Aliphatic Amide-Imide Resin Composition for Low-Warpage Transparency
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Solution Overview
Problem
Existing curable resin compositions for printed wiring boards, containing phenol or polyimide resins, exhibit yellow or reddish-brown coloration and have inadequate heat resistance and light transmittance, leading to unsatisfactory performance in applications requiring transparency and thermal stability.
Innovation Solution
A curable resin composition comprising an amide-imide resin, a thermosetting resin, a thermosetting accelerator, and inorganic particles, where the amide-imide resin is synthesized from an isocyanurate-type polyisocyanate and an aliphatic tricarboxylic anhydride, with specific molecular weights and structures to enhance transparency and thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If phenol resin or polyimide resin with aromatic ring is used, then heat resistance is improved, but light transmittance deteriorates (yellow or reddish-brown coloration)
Solution Approach 1:
The patent changes the chemical structure parameters of the resin from aromatic-based (phenol, polyimide) to aliphatic-based (amide-imide from aliphatic isocyanate and aliphatic carboxylic acid). This parameter change in molecular structure eliminates the chromophoric aromatic rings while maintaining the thermal stability provided by the amide-imide bond structure, thereby achieving both heat resistance and high light transmittance.
Solution Approach 2:
The patent creates a composite resin system combining amide-imide resin with specific additives and modifiers to achieve a balance of properties. The composite formulation includes the aliphatic amide-imide base resin combined with curing agents and other components that collectively provide heat resistance without compromising light transmittance.
2Stability of the object's composition
If conventional thermosetting resins are used, then structural stability is improved, but warpage increases due to high residual stress
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system to aliphatic amide-imide structure, which inherently produces lower residual stress during curing compared to conventional aromatic thermosetting resins. This parameter change maintains crosslinking density for structural stability while reducing the stress that causes warpage.
Solution Approach 2:
The patent introduces specific intermediate compounds and modifiers in the resin formulation that act as stress relievers during the curing process. These intermediary substances facilitate a more gradual and uniform curing reaction, reducing thermal and chemical stress buildup that would otherwise lead to warpage while maintaining final structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent heat resistance, low warpage, and high light transmittance in the cured product, with reduced residual stress, making it suitable for applications like interlayer insulating materials in printed wiring boards.
Implementation Method 1
an amide-imide resin, wherein the amide-imide resin is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic anhydride having an aliphatic structure
Data Source
AI summary
Provided is a curable resin composition that has excellent heat resistance and low warpage and is, furthermore, capable of improving light transmittance in cured products, a dry film and its cured product of, and an electronic component containing the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a thermosetting resin, (C) a thermosetting accelerator and (D) inorganic particles, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic anhydride having an aliphatic structure and has a number-average molecular weight of 500 to 1000; a dry film and its cured product; and an electronic component containing the cured product were obtained.