Circuit Susbtrate Materials TRIZ Cases

Controlling copper foil surface Sdq to 0.120 or less cuts high-frequency conduction loss while preserving resin adhesion in flexible wiring boards.

By limiting copper foil surface roughness to very low sdr, this case cuts high-frequency transmission loss while preserving resin adhesion.

A long-chain maleimide and reactive phosphorus resin raises loss tangent to cut PCB warpage while improving flame resistance.

A protected DOPO-based resin composition improves flame retardancy at low loading while preserving high Tg and low dielectric properties.

Controlled alpha-phase content and surface roughness keep spherical alumina thermally conductive, kneadable, and uniformly dispersed in resin.

Tight thickness control in a 400 µm+ metal clad laminate cuts characteristic impedance variation and preserves signal quality in PCBs.

Selective Ni plating blocks solder diffusion into the brazing layer, improving furnace passing resistance and heat cycle durability.

Etching away the oxidized first metal layer enables direct via contact to the metal substrate, lowering wiring resistance.

A silicon- or acrylic-based adhesion layer strengthens insulating-layer bonding on smooth conductive wiring without raising resistance.

Controlling nitrogen and oxygen on the copper surface improves solder wettability and bonding reliability in ceramic circuit boards.

A tuned epoxy-cyanate-phenol resin with fine silica improves PCB insulating film curing, copper adhesion, and high-temperature durability.

A molybdenum protective layer prevents copper oxidation and can be removed with flux, cutting etching steps, process complexity, and cost.

A rubber-modified epoxy resin layer improves coating uniformity, insulation, heat conduction, and solder heat resistance on metal substrates.

Specific acid anhydride and diamine structures let polyimide substrates reach low dielectric constant and low thermal expansion together.

Alternating copper and insulation laminations expand signal transmission area and lower high-frequency PCB loss despite copper roughness.

Replacing glass fiber with basalt fiber cuts PCB environmental impact while preserving thermal resistance, insulation, and strength.

A maleimide-imide resin system limits moisture-driven dielectric drift and thermal expansion in wiring board laminates during humid use and reflow.

Cyclic carbonate units and controlled terminal hydroxyl content help lower dielectric loss while preserving foil adhesion.

Controlled polycarbonate resin structures reduce dielectric loss and thermal expansion while supporting metal adhesion in high-frequency substrates.

A controlled width sequence for the base, wire, and cover layers prevents resist interference and shapes the metal support during dual-sided etching.

Different-temperature pyridine or imidazole accelerators stagger thermal curing to limit cracking while retaining low dielectric properties in integrated circuits.

A metallic plate and semi-open coolant manifold integrate with a PCB to reduce packaging volume while improving power-module cooling.

A boron-phosphorus accelerator and phosphorus stabilizer help epoxy insulation cure quickly while retaining voltage resistance, adhesion, and heat resistance.

A tailored oxide composition gives glass fibers low dielectric constant and loss while absorbing UV that can degrade resin.

Basalt fiber prepregs and epoxy preserve PCB insulation and strength while reducing the environmental burden of glass fiber.

This case tunes oxide content for low dielectric properties, low-temperature spinning, and reduced UV-driven resin deterioration.

This coating combines conductive polyaniline with dense polysiloxane to limit charge buildup and preserve stability up to 170°C.

Uniform conductor layers simplify accurate pressed-coordinate sensing.

This composition uses aliphatic amide-imide chemistry to balance heat resistance, light transmittance, and warpage.

A 2–15 μm insulating film and 10–50 μm adhesive layer improve pattern filling while enabling thinner printed wiring boards.

A glass substrate with controlled Si, Al, and K content supports a fine metal wire mesh electrode in an OGS touch sensor.

Low-ionic siloxane reduces dielectric loss tangent and relative permittivity while maintaining curability.

Control support thermal expansion to maintain peel strength in printed wiring board insulating layers.

Optimized oxide ratios reduce forming temperatures and costs while maintaining low dielectric constants for high-performance PCBs.

Segmenting the insulating layer into discrete blocks reduces parasitic capacitance between cathode and touch electrodes, enhancing bending performance.

Reactive phosphorus additives modify unsaturated polyphenylene ether resin to resolve the trade-off between flame retardancy and low dielectric constant.

Fluorinated poly(ester-imide) polymers maintain low dissipation factors under humid conditions, solving moisture-induced signal loss in 5G applications.

A maleimide resin composition with specific additives improves thermal decomposition and flexural modulus for advanced printed circuit boards.

Segmented AB-type block copolymers resolve premature silane condensation and weak interfaces in lead-free PCB manufacturing.

Heat-treated quartz glass cloth in resin substrate maintains low dielectric loss tangent and stable frequency dependence for high-speed communication.

A glass-ceramics composite material with aluminum nitride filler and controlled boron oxide flux.

A bonded body uses a specific Ag-Cu bonding layer to maintain copper plate conductivity.

Thermosetting resin composition with acrylic elastomer and maleimide compound reduces thermal expansion in coreless substrates.

A curable polymer with specific structural units reduces dielectric dissipation factor in wiring boards.

Composite liquid metals with oxide fillers improve substrate wettability and viscosity, enabling stable conductivity under mechanical strain.

A polyimide film achieves low dielectric loss through controlled planar orientation and specific aromatic diamine structures.

Modified maleimide resins with silane-coupled fillers improve compatibility, maintaining heat resistance after water absorption.

An epoxy resin composition incorporating a straight chain alkylene group between an isocyanurate skeleton and epoxy group.

An asymmetric metal plate bonded to a ceramic substrate redistributes thermal stress, preventing cracks and warping while improving heat dissipation.

A resin composition combining cyanate, polybutadiene, and maleimide compounds to enhance dielectric properties.

Island and strip segmentation isolates electrical elements from mechanical stress, preventing crack propagation in the wiring.