Coreless Substrate Prepreg Resin Composition Warpage Reduction

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Solution Overview

Problem

Coreless substrates face challenges with warpage due to differences in thermal expansion coefficients between semiconductor elements and printed wiring boards, leading to connection failures and requiring improved bonding strength and thermal management.

Innovation Solution

A prepreg comprising a thermosetting resin composition with (meth)acrylic elastomer, an amine compound, and a maleimide compound, which reduces thermal expansion and enhances bonding strength with metal circuits, while maintaining heat resistance and desmear resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the support (core substrate) is removed to create a coreless substrate, then the wiring density and integration are improved, but the rigidity is lowered causing warpage

Engineering Contradiction:

Improvewiring densityVSAvoidrigidity

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent changes the physical and chemical parameters of the resin composition, specifically reducing the elastic modulus and coefficient of thermal expansion to optimize the build-up layer's properties for warpage reduction while maintaining high wiring density capability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining glass cloth with a specifically formulated resin composition containing low elastic modulus components and low coefficient of thermal expansion components, creating a build-up layer that simultaneously provides structural support and thermal expansion matching

Inventive Principle:

Principle #40Composite materials

2Reliability

If the coefficient of thermal expansion of the printed wiring board is reduced to match the semiconductor element, then warpage is suppressed, but the bonding strength with metal circuits may be affected

Engineering Contradiction:

Improvewarpage suppressionVSAvoidbonding strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent precisely controls the coefficient of thermal expansion parameter of the resin composition to match the semiconductor element, reducing thermal expansion mismatch and warpage while maintaining bonding strength through optimized chemical composition

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent applies different functional properties to different aspects of the resin composition: low coefficient of thermal expansion for warpage suppression and appropriate bonding characteristics for metal circuit adhesion, achieving both goals through localized property optimization

Inventive Principle:

Principle #3Local quality

3Reliability

If the elastic modulus of the resin composition is reduced to achieve low thermal expansion, then warpage is reduced, but the bonding strength with metal circuits decreases

Engineering Contradiction:

Improvewarpage reductionVSAvoidbonding strength with metal circuit

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent changes multiple parameters of the resin composition simultaneously: reducing elastic modulus for warpage reduction while adjusting the chemical composition (adding specific components) to maintain bonding strength, achieving a balanced optimization of both properties

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite resin composition that combines low elastic modulus components with bonding-enhancing components, where the synergistic effect of the composite material achieves both warpage reduction and adequate bonding strength

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The prepreg effectively reduces warpage, improves bonding strength, and maintains heat resistance, addressing the thermal expansion mismatch and connection failure issues in coreless substrates.

Implementation Method 1

the coefficient of thermal expansion of a prepreg obtained by impregnating a glass cloth with a resin composition follows the Scapery Equation represented by the following formula: A≈(ArErFr+AgEgFg)/(ErFr+EgFg)

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

a prepreg formed of a resin composition containing a specific low elasticity component and a woven fabric base material as a prepreg capable of reducing warpage of a semiconductor package

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 3

a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups

Methodology Applied

Scientific EffectChemical bonding: Chemical Bonding

Data Source

PatentUS10681807B2Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package

Publication Date: 2020.06.09 RESONAC CORP

AI summary

The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.