Boron-Phosphorus Epoxy Resin Composition for Fast Curing
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Solution Overview
Problem
Existing thermosetting epoxy resin compositions used for insulating layers in metal-based circuit boards fail to achieve sufficient voltage resistance, adhesiveness, and heat resistance in a short curing time, despite improvements in curability and storage stability.
Innovation Solution
A thermosetting epoxy resin composition containing an aromatic amine compound, a boron-phosphorus complex, and a phosphorus compound, along with an optional inorganic filler, is used to form a cured film that enhances voltage resistance, adhesiveness, and heat resistance in a short curing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an aromatic diamine compound is used as a curing agent for epoxy resin, then the glass transition temperature of the cured product is high, but the curability is inferior and the curing time is long
Solution Approach 1:
A boron-phosphorus complex is introduced as a curing accelerator to mediate the curing reaction between epoxy resin and aromatic diamine compound. This intermediary substance significantly enhances the curability and shortens the curing time while preserving the high glass transition temperature property of the aromatic diamine-based cured product.
Solution Approach 2:
The addition of the boron-phosphorus complex changes the kinetic parameters of the curing reaction, increasing the reaction rate and reducing the time required to achieve complete curing, without altering the final thermal properties of the cured product.
2Productivity
If a boron-phosphorus complex is added as a curing accelerator to improve curability, then the curing time is shortened, but the storage stability deteriorates
Solution Approach 1:
A phosphorus compound is introduced as a stabilizer that acts as an intermediary to protect the boron-phosphorus complex from premature decomposition or unwanted reactions during storage, thereby maintaining storage stability while preserving the curing accelerator's effectiveness.
Solution Approach 2:
The phosphorus compound provides beforehand cushioning by preventing potential degradation of the boron-phosphorus complex during storage, ensuring that the curing accelerator remains effective when needed without compromising storage stability.
3Device complexity
If conventional epoxy resin compositions are used, then the formulation is simple, but the cured film does not satisfy all requirements of voltage resistance, adhesiveness, and heat resistance in a short curing time
Solution Approach 1:
The invention creates a composite curing system combining epoxy resin, aromatic diamine compound, boron-phosphorus complex, and phosphorus compound. This composite formulation achieves superior voltage resistance, adhesiveness, and heat resistance in the cured film while maintaining reasonable formulation simplicity.
Solution Approach 2:
The boron-phosphorus complex serves multiple functions: it accelerates curing (improving productivity), enhances crosslinking density (improving heat resistance and adhesiveness), and works synergistically with the phosphorus compound stabilizer. This multi-functionality allows a single additive package to satisfy multiple performance requirements simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of a cured film with improved voltage resistance, adhesiveness, and heat resistance, suitable for high-density metal-based circuit boards and power modules.
Implementation Method 1
a boron-phosphorus complex represented by the following general formula (2)... improve curability of a thermosetting epoxy resin composition and shorten a curing time
Implementation Method 2
a phosphorus compound represented by the following general formula (3)... tends to improve curability of the epoxy resin composition and also tends to suppress deterioration of storage stability
Implementation Method 3
a thermosetting resin composition using an epoxy resin has been widely used... an aromatic diamine compound may be used as a curing agent
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
According to an embodiment, a thermosetting epoxy resin composition including an epoxy resin, an aromatic amine compound, a boron-phosphorus complex, and a phosphorus compound is provided. The aromatic amine compound is represented by the following general formula (1) (where R1 represents an alkyl group, m represents an integer of 2 or more, n represents an integer of 0 or more, and m and n satisfy m + n ≤ 6, and when n is an integer of 2 or more, a plurality of R1 may be the same as or different from each other).