Epoxy Resin Composition with Alkylene Group for Low Viscosity
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Solution Overview
Problem
Epoxy resin compositions used in electronic materials face challenges with high viscosity, which hinders handleability and the ability to coat fine irregular structures, and typically have high dielectric constants, leading to issues with electric signal delay and capacitance adjustment.
Innovation Solution
An epoxy resin composition incorporating an epoxy compound with a specific structure featuring a straight chain alkylene group of 5 to 7 carbon atoms between an isocyanurate skeleton and epoxy group, combined with a curing agent, to achieve low viscosity and dielectric constant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an epoxy compound with a rigid molecular skeleton is used to achieve high heat resistance and light resistance, then reliability is improved, but viscosity increases making handleability poor
Solution Approach 1:
The invention changes the molecular structure parameters of the epoxy compound by introducing a specific rigid skeleton structure with controlled molecular weight and side chain configuration. This allows achieving the desired reliability (heat and light resistance) while maintaining manageable viscosity through precise structural parameter optimization
Solution Approach 2:
The invention creates a composite epoxy compound structure combining rigid skeleton units for reliability with appropriate side chains to control viscosity. The compound integrates multiple functional elements within a single molecular structure to simultaneously achieve heat resistance, light resistance, and handleability
2Reliability
If an epoxy compound with high liquid viscosity is used to achieve high heat resistance, then reliability is improved, but the resin composition cannot bury fine irregular structure when coated
Solution Approach 1:
The invention optimizes the viscosity parameter of the epoxy compound by controlling molecular weight and structural configuration. The rigid skeleton provides heat resistance while the optimized molecular parameters ensure viscosity remains low enough to fill fine irregular structures during coating processes
3Reliability
If a conventional epoxy resin is used to achieve high polarity and reliability, then heat resistance is improved, but dielectric constant remains high causing electric signal delay
Solution Approach 1:
The invention changes the chemical composition parameters of the epoxy compound to reduce polarity while maintaining heat resistance through the rigid skeleton structure. The specific molecular structure achieves lower dielectric constant to prevent electric signal delay while preserving thermal stability
Data Source
AI summary
There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent: wherein R1 to R3 each independently are a hydrogen atom or methyl group, and L1 to L3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.