Integrated Metallic Plate Cooling for Compact Power Modules

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Solution Overview

Problem

Existing cooling systems for vehicle power modules compromise packaging and layout, leading to decreased power density and increased waste heat losses, particularly in electric vehicle inverters.

Innovation Solution

A cooling system integrating a metallic plate with a PCB mounted on one side, separated by a dielectric isolation layer, and a semi-open coolant manifold on the opposite side, enhancing thermal management and compact packaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional separate cooling systems are used for power modules, then cooling function is provided, but packaging volume increases and power density decreases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidpackaging volume

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent combines the power module housing and cooling system into a single integrated structure. The housing contains internal cavities that serve as coolant channels, merging the structural enclosure function with the thermal management function. This eliminates the need for separate cooling components, reducing overall packaging volume while maintaining effective cooling of power semiconductor devices.

Inventive Principle:

Principle #5Merging (Combining)

2Temperature

If traditional separate cooling systems are used for power modules, then cooling function is provided, but power density decreases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidpower density

Core Design Contradiction:

TemperatureVSPower

Solution Approach 1:

The housing simultaneously serves as both the structural enclosure and the cooling system, with integrated coolant channels. This merging of functions eliminates wasted space and reduces the overall system volume, thereby increasing power density while maintaining effective thermal management for high-power applications.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing performs multiple functions: it provides structural support, encloses the power electronic components, and serves as the cooling system through integrated coolant channels. This multi-functionality reduces the number of separate components needed, decreasing packaging volume and increasing power density while ensuring adequate cooling.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If additional wiring and integrating components are added for cooling, then cooling function is achieved, but device complexity increases

Engineering Contradiction:

Improvecooling functionVSAvoidwiring and integrating components

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The cooling channels are directly formed as integral parts of the housing structure, eliminating the need for separate wiring harnesses and external cooling components. The housing walls themselves form the coolant flow paths, significantly reducing the number of integrating components and simplifying the overall device architecture.

Inventive Principle:

Principle #5Merging (Combining)

4Power

If compact packaging is achieved through integration, then power density increases, but thermal management challenges increase

Engineering Contradiction:

Improvepower densityVSAvoidthermal management

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The integrated housing with internal coolant channels provides efficient thermal management in a compact form. The close proximity of the coolant channels to the power semiconductor devices enables effective heat removal, managing thermal challenges while maintaining high power density through the consolidated structure.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Achieves higher power density and superior cooling efficiency, reducing packaging size and waste heat losses in vehicle power modules.

Implementation Method 1

a dielectric isolation layer separating the PCB from the metallic plate

Methodology Applied

Scientific EffectDielectric isolation: Dielectric

Implementation Method 2

a semi-open coolant manifold directly mounted to a second side of the metallic plate

Methodology Applied

Scientific EffectConvection cooling: Convection

Implementation Method 3

By integrating the power system with its peripheral components and a heat exchanger in a compact package, a higher power density, a superior cooling, and a greater overall inverter efficiency may be achieved

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12453046B2Systems for thermal management of an electronic device

Publication Date: 2025.10.21 DANA CANADA CORP

AI summary

Systems are provided for a cooling system for an electric device. In one example, a system includes a metallic plate coupled to a circuit board and a coolant manifold. The coolant manifold comprises a semi-open coolant channel configured to flow coolant in contact with the metallic plate.