Basalt Fiber Multilayer PCB for Sustainable Thermal Reliability

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Solution Overview

Problem

Glass fiber fabric-based PCBs have significant environmental impacts due to energy-intensive production processes, non-renewable raw materials, and challenging recycling and disposal, leading to electronic waste accumulation.

Innovation Solution

Replace glass fiber with basalt fiber, derived from volcanic rock, to fabricate PCBs, utilizing basalt fiber fabric and epoxy resin, which are more sustainable, have better mechanical and electrical properties, and are easier to recycle.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If glass fiber fabric is used in PCB fabrication, then electrical and mechanical properties are excellent, but environmental impact is significant due to energy-intensive production and non-renewable materials

Engineering Contradiction:

Improveelectrical and mechanical propertiesVSAvoidenvironmental impact

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the material parameter from glass fiber to basalt fiber, which has comparable or superior mechanical and electrical properties while being derived from renewable volcanic rock. This parameter substitution resolves the contradiction by maintaining reliability while reducing environmental harm through lower production energy consumption and renewable sourcing

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite material construction with basalt fiber fabric combined with epoxy resin to create a PCB substrate that achieves both excellent mechanical strength and electrical insulation properties. This composite approach allows optimization of individual material properties while achieving overall system performance comparable to glass fiber PCBs

Inventive Principle:

Principle #40Composite materials

2Strength

If glass fiber fabric is used in PCB fabrication, then structural integrity is maintained, but recycling and disposal become challenging leading to electronic waste accumulation

Engineering Contradiction:

Improvestructural integrityVSAvoidrecycling and disposal

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent changes the fiber material parameter from glass to basalt, which has comparable tensile strength and structural properties. The basalt fiber PCB maintains structural integrity while enabling easier recycling because basalt is a natural material that can be more readily separated and reused compared to synthetic glass fiber composites

Inventive Principle:

Principle #35Parameter changes

3Object-affected harmful factors

If basalt fiber is used instead of glass fiber, then environmental sustainability is improved, but manufacturing process complexity may increase

Engineering Contradiction:

Improveenvironmental sustainabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent uses basalt fiber fabric that is manufactured to have uniform properties and consistent structure, similar to conventional glass fiber fabrics. This homogeneity in material properties allows existing PCB manufacturing processes to be adapted with minimal changes, reducing the complexity increase that might otherwise result from using a novel natural material

Inventive Principle:

Principle #33Homogeneity

4Strength

If basalt fiber fabric is used in PCB, then mechanical strength and electrical insulation are improved, but material availability and supply chain may be limited

Engineering Contradiction:

Improvemechanical strength and electrical insulationVSAvoidmaterial availability

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent positions basalt fiber as a universal substitute for glass fiber in PCB applications. Basalt fiber fabric serves multiple functions including structural reinforcement, electrical insulation, and thermal management, making it adaptable to various PCB designs and applications while expanding material availability beyond the limitations of glass fiber supply chains

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Basalt fiber PCBs reduce environmental impact, offer higher mechanical strength, better thermal resistance, and improved electrical insulation, while maintaining signal integrity and design flexibility, with comparable thermal and electrical properties to glass fiber PCBs.

Implementation Method 1

impregnating the basalt fiber fabric with an epoxy resin

Methodology Applied

Scientific EffectAbsorption: Absorption (physical)

Implementation Method 2

compression curing the basalt fiber fabric and the epoxy resin

Methodology Applied

Scientific EffectCuring: Heat Treatment

Data Source

PatentUS20250351266A1Eco-friendly printed circuit board for high temperature and low temperature applications

Publication Date: 2025.11.13 SANDISK TECHNOLOGIES LLC

AI summary

A multi-layer printed circuit board (PCB) is fabricated using basalt fibers instead of glass fibers. Using basalt fibers in lieu of glass fibers makes the PCB more environmentally friendly without sacrificing mechanical and electrical properties. The multi-layer PCB includes a basalt fiber core comprised of a basalt fiber prepreg provided between two copper layers. A first copper layer and a second copper are coupled to different sides of the basalt fiber core. A first basalt fiber prepreg is coupled to the first copper layer and a second basalt fiber prepreg is coupled to the second copper layer.