Copper Composite Lamination for Low-Loss High-Frequency PCB Signals
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Solution Overview
Problem
Copper materials used in signal layers of printed circuit boards (PCBs) exhibit high transmission loss due to high surface roughness and grain boundaries, limiting their application in high-frequency high-speed signal transmission.
Innovation Solution
A low-transmission-loss copper-based composite material is developed by stacking lamination units of conductor and insulation layers, with a single-crystal copper layer, and optionally incorporating graphene and boron nitride, to increase effective signal transmission area and reduce surface roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If copper material is used as conductor layer, then electrical conductivity is improved, but surface roughness increases and transmission loss worsens
Solution Approach 1:
The patent uses a composite structure consisting of multiple copper layers (including single-crystal copper layers) and insulation layers. This composite material approach combines the high electrical conductivity of copper with the low roughness of single-crystal structures and the shielding effect of insulation layers, achieving both low transmission loss and high signal transmission quality simultaneously.
Solution Approach 2:
The conductor layer is segmented into multiple sub-layers including single-crystal copper layers and ordinary copper layers, with insulation layers interspersed between them. This segmentation allows each layer to perform its specific function: single-crystal layers provide smooth signal transmission paths, ordinary copper layers provide electrical conductivity, and insulation layers provide shielding and structural support.
2Manufacturing precision
If single-crystal copper layer is used, then surface roughness is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by using single-crystal copper layers only in specific positions where low surface roughness is most critical for signal transmission, while other copper layers can be ordinary polycrystalline copper. The insulation layers are strategically placed to provide shielding where needed. This localized application of high-precision single-crystal structures reduces overall manufacturing complexity while maintaining the benefits where most needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material achieves a transmission loss of 0.4-0.9 dB/inch at 20 GHz, significantly lower than single-crystal copper foil, enabling effective high-frequency high-speed signal transmission.
Implementation Method 1
An increase in signal frequency leads to an obvious skin effect, and the signal is centralized on a surface of the conductor material for transmission
Implementation Method 2
a plurality of lamination units repeatedly stacked in sequence along a preset direction, each lamination unit including a conductor layer and an insulation layer covering a surface of the conductor layer
Data Source
AI summary
The present disclosure relates to the technical field of composite materials, in particular, to a low-transmission-loss copper-based composite material and a preparation method thereof, a PCB, and an electronic component. The low-transmission-loss copper-based composite material comprises: a plurality of lamination units repeatedly stacked in sequence along a preset direction, each lamination unit comprising a conductor layer and an insulation layer covering a surface of the conductor layer along the preset direction, and wherein the conductor layer comprises a single-crystal copper layer. The low-transmission-loss copper-based composite material provided in the present disclosure can effectively increase the effective area for signal transmission of the low-transmission-loss copper-based composite material, and can effectively reduce the transmission loss of the entire low-transmission-loss copper-based composite material without reducing the surface roughness of the single-crystal copper layer, which facilitates the application of the low-transmission-loss copper-based composite material in high-frequency high-speed signal transmission.