Wiring Circuit Board Layering for Precise Dual-Sided Etching
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Solution Overview
Problem
Existing wiring circuit boards face issues in forming a metal supporting layer with a desired shape due to the insulating cover layer protruding beyond the etching resist, hindering the etching process when the metal sheet is processed from both sides, especially when the cover layer is wider than the insulating base layer.
Innovation Solution
A method involving forming an insulating base layer, a narrower wiring layer, and an even narrower insulating cover layer, followed by etching the metal sheet from both sides to create a metal supporting layer with a width smaller than the base layer, using resist patterns to prevent protrusion and ensure accurate shaping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulating cover layer is made wider than the insulating base layer to improve coverage, then the coverage of the wiring layer is improved, but the etching process is hindered when the metal sheet is processed from both sides
Solution Approach 1:
The patent applies preliminary action by forming the insulating cover layer with a width smaller than the insulating base layer before the etching process. This preventive measure ensures that the cover layer does not protrude beyond the etching resist, thereby avoiding interference with the subsequent etching of the metal sheet from both sides. The width relationship Wcover < Wbase is established in advance to prevent the harmful effect of protrusion.
2Adaptability or versatility
If the metal supporting layer is made narrower than the insulating base layer to meet design requirements, then the design flexibility is improved, but the etching alignment becomes more difficult
Solution Approach 1:
The patent uses preliminary action by pre-forming the insulating cover layer with controlled width (Wcover < Wbase) that serves as a reference structure before etching. This pre-formed structure guides the etching process to achieve the desired narrower metal supporting layer (Wmetal < Wbase) while maintaining proper alignment, thus enabling design flexibility without compromising manufacturing precision.
Solution Approach 2:
The insulating cover layer acts as an intermediary structure between the insulating base layer and the metal supporting layer. By controlling the width of this intermediate layer to be smaller than the base layer, it provides a reference boundary that facilitates precise etching of the metal sheet, enabling the metal supporting layer to be narrower than the base layer while maintaining alignment accuracy.
3Productivity
If etching is carried out by bringing the etching solution into contact with the metal sheet from both above and below to improve production efficiency, then the productivity is improved, but the etching resist must be disposed in a predetermined pattern on both surfaces increasing complexity
Solution Approach 1:
The patent applies preliminary action by pre-controlling the width of the insulating cover layer (Wcover < Wbase) before the dual-sided etching process. This preliminary width control ensures that the cover layer does not protrude beyond the etching resist boundaries, allowing the etching resist to be disposed in a predetermined pattern on both surfaces without being disrupted by cover layer interference, thus enabling efficient dual-sided etching.
4Reliability
If the insulating cover layer protrudes beyond the etching resist to maintain its width larger than the base layer, then the coverage is maintained, but the metal supporting layer cannot be formed into the desired shape
Solution Approach 1:
The patent resolves this contradiction by applying preliminary action - the insulating cover layer is formed with a width smaller than the insulating base layer (Wcover < Wbase) before the etching process. This preliminary width configuration prevents protrusion beyond the etching resist, ensuring that the etching solution can properly access the metal sheet edges from both sides and form the metal supporting layer in the desired shape without interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the formation of a metal supporting layer in a desired shape without defects, ensuring precise etching and alignment with the base and cover layers, thereby improving production efficiency and accuracy.
Implementation Method 1
the outer shape of the metal sheet is processed by etching to form the metal supporting layer
Data Source
AI summary
A method for manufacturing a wiring circuit board includes first forming an insulating base layer on a one-side surface in a thickness direction of a metal sheet, second forming a conductor layer on a one-side surface in the thickness direction of the insulating base layer so that a width of a wire is smaller than a width W2 of a wiring body base portion, third forming an insulating cover layer on a one-side surface in the thickness direction of the wiring body base portion exposed from the wire so that the wire is covered with the insulating cover layer and a width of a wiring body cover portion is smaller than the width W2, and fourth forming a metal supporting layer by etching the metal sheet from both sides in the thickness direction so that a width of a wiring body metal portion is smaller than the width W2.