Curable Polymer for Low Dielectric Loss and High Tg Wiring Boards
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Solution Overview
Problem
Existing wiring boards face challenges in reducing dielectric dissipation factor (Df) under high-frequency conditions and maintaining a sufficiently high glass transition temperature (Tg) for reliable performance in high-frequency and high-temperature environments.
Innovation Solution
A curable polymer comprising structural units represented by a specific formula, which can be used to produce a resin with reduced dielectric dissipation factor (Df) and high glass transition temperature (Tg), is developed. This polymer is incorporated into a curable composition, prepreg, multilayer body, metal clad laminate, and wiring board to enhance their electrical and thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a modified polyphenylene ether (modified PPE) oligomer is used as a curable polymer, then the resin provides sufficient glass transition temperature (Tg), but the dielectric dissipation factor (Df) increases under high-frequency conditions
Solution Approach 1:
The patent changes the chemical structure parameters of the curable polymer by introducing structural units with specific formulas that eliminate polar atoms from the main chain. This structural parameter change reduces dielectric loss while maintaining thermal stability through appropriate molecular weight and crosslinking density control.
Solution Approach 2:
The patent uses a composite curable polymer system combining multiple structural units (including aromatic rings, alkyl groups, and crosslinking groups) to achieve both low dielectric loss and high glass transition temperature. The composite structure allows simultaneous optimization of electrical and thermal properties.
2Loss of energy
If the resin structure is modified to reduce dielectric dissipation factor (Df), then high-frequency performance improves, but the glass transition temperature (Tg) may decrease
Solution Approach 1:
The patent applies local quality by introducing non-polar structural units at specific positions in the polymer chain while maintaining crosslinking density in other regions. This localized structural modification reduces dielectric loss without compromising the overall thermal stability provided by the crosslinked network.
Solution Approach 2:
The patent carefully controls molecular weight parameters and crosslinking density to maintain glass transition temperature while implementing structural changes that reduce dielectric loss. The parameter optimization ensures both low Df and high Tg are achieved simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable polymer effectively reduces the dielectric dissipation factor (Df) under high-frequency conditions and maintains a sufficiently high glass transition temperature (Tg), making it suitable for use in high-frequency and high-temperature applications, such as portable electronic devices and communication equipment.
Implementation Method 1
a curable polymer comprising one or more type(s) of structural units (UX) represented by formula (1) and one or more type(s) of other structural units other than the structural units (UX)
Data Source
AI summary
A curable polymer comprising one or more type(s) of structural units (UX) represented by the following formula and one or more type(s) of other structural units other than the structural units (UX) and a curable polymer comprising only one or more type(s) of structural units (UX) represented by the following formula as structural units, and which is for production of a prepreg, a metal clad laminate or a wiring board.in which R1 and R2 each independently represent a hydrogen atom, a hydroxyl group or an organic group; the benzene ring optionally has a substituent other than the substituent in the above formula; and n is an integer of 0 or more.