Packaging Substrate Adhesion Reinforcement for Low-Roughness Wiring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing packaging technologies for semiconductor devices face challenges in achieving high-frequency performance due to high resistance and limited wiring pitch, particularly with ceramic and resin substrates, while silicon and glass substrates offer potential but require improved electrical interconnections.
Innovation Solution
A packaging substrate design featuring a core layer with a conductive layer and an adhesion reinforcement layer, utilizing silicon-based or acrylic-based compounds to enhance adhesion and maintain smooth surface roughness, along with an insulating layer to stabilize electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a ceramic substrate is used for packaging, then structural strength is improved, but electrical performance deteriorates due to high resistance and high dielectric constant
Solution Approach 1:
The patent segments the packaging substrate into multiple functional layers: a ceramic lower substrate providing structural strength, a glass upper substrate providing smooth surface for fine wiring, and intermediate adhesion layers. This segmentation allows each layer to optimize its specific function while working together as a unified packaging structure.
Solution Approach 2:
The patent employs composite material construction by combining ceramic and glass substrates with adhesion reinforcement layers. The ceramic-glass composite structure leverages the mechanical strength of ceramic and the electrical performance of glass, creating a packaging substrate that satisfies both structural and electrical requirements.
2Reliability
If a resin substrate is used for packaging, then electrical performance is improved, but manufacturing precision deteriorates due to limitation in reducing wiring pitch
Solution Approach 1:
The patent segments the packaging substrate into multiple functional layers: a ceramic lower substrate providing structural strength, a glass upper substrate providing smooth surface for fine wiring, and intermediate adhesion layers. This segmentation allows each layer to optimize its specific function while working together as a unified packaging structure.
Solution Approach 2:
The patent applies local quality by using glass material specifically for the upper substrate surface where fine wiring is formed, while using ceramic for the lower substrate providing structural support. The glass layer provides the smooth surface quality needed for high-precision wiring patterns, while the ceramic layer provides bulk structural properties.
3Strength
If the surface roughness of the conductive layer is increased to improve adhesion, then adhesion strength is improved, but electrical performance deteriorates due to increased resistance
Solution Approach 1:
The patent segments the adhesion function from the electrical conduction function by introducing a dedicated adhesion reinforcement layer between the conductive layer and insulating layer. The conductive layer maintains smooth surface for electrical performance, while the adhesion reinforcement layer provides the necessary bonding strength.
Solution Approach 2:
The patent introduces an adhesion reinforcement layer as an intermediary between the smooth conductive layer and the insulating layer. This intermediary layer provides the necessary adhesion strength while allowing the conductive layer to maintain its smooth surface for optimal electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves stable electrical reliability and high-frequency signal transmission with improved adhesion between layers, enabling high integration and durable electrical connections.
Implementation Method 1
an adhesion reinforcement layer disposed on the core layer and surrounding at least a portion of an upper surface of the first conductive layer. The adhesion reinforcement layer includes at least one selected from the group consisting of silicon-based compounds, acrylic-based compounds, and combinations thereof.
Data Source
Figure 1~3
AI summary
A packaging substrate according to the present disclosure comprises a core layer; a first conductive layer, which is a conductive layer disposed in contact with an upper surface of the core layer; and an adhesion reinforcement layer disposed on the core layer and surrounding at least a portion of the first conductive layer. The adhesion reinforcement layer comprises any one selected from the group consisting of a silicon-based compound, an acrylic-based compound, and a combination thereof. An arithmetic average roughness (Ra) value of the upper surface of the first conductive layer is 150 nm or less. In this case, it is possible to effectively improve the adhesion strength of the insulating layer to the first conductive layer without excessively roughening the first conductive layer.