Thick Metal Clad PCB Substrate for Stable Characteristic Impedance
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Solution Overview
Problem
There is an increasing need for advanced control of characteristic impedance in substrates due to the rise in signal speed, particularly in laminates with large thickness, to maintain signal quality.
Innovation Solution
A substrate comprising a metal clad laminate with a specific thickness and thickness variation, incorporating a metal foil and cured prepreg, with an insulating layer, to minimize impedance variation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the metal clad laminate is increased to improve signal transmission stability, then the variation in characteristic impedance increases, but signal quality deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the thickness of the metal clad laminate to be 400 μm or more while limiting the thickness variation to 10 μm or less. This specific parameter range resolves the contradiction by providing sufficient thickness for signal stability while maintaining tight control over impedance variation through the defined thickness tolerance.
Solution Approach 2:
The patent applies local quality by implementing a detailed measurement methodology that divides the metal clad laminate into multiple measurement regions and takes numerous measurements across the surface. This localized measurement approach ensures that thickness variations are controlled within specific areas, maintaining uniform impedance characteristics across the entire substrate.
2Manufacturing precision
If the thickness of the metal clad laminate is increased to reduce impedance variation, then the manufacturing complexity increases, but signal quality improves
Solution Approach 1:
The patent applies self-service by establishing a comprehensive measurement standard that enables manufacturers to autonomously control and verify the thickness of metal clad laminates. The detailed measurement methodology allows production systems to self-regulate thickness parameters without requiring complex external inspection systems, simplifying the overall manufacturing process while maintaining high precision.
Data Source
Figure 1(a)~1(b)
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AI summary
Disclosed are a substrate including a metal clad laminate including a metal foil and a cured product of a prepreg, and an insulating layer laminated on at least one surface of the metal clad laminate, in which the metal clad laminate has 400 µm or more of an average thickness T1 measured by a predetermined method using a laser displacement gauge, and 10 µm or less of an absolute value D1 of a difference between a maximum value and a minimum value of a thickness, and a printed wiring board and a semiconductor package using the substrate.