Wiring Board Resin Composition for Low Dielectric Drift and CTE
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Solution Overview
Problem
Existing substrate materials for wiring boards fail to provide cured products with low relative dielectric constant, low dielectric loss tangent, and low coefficient of thermal expansion, while also being susceptible to water absorption and environmental changes, leading to issues like warpage and mounting failures during reflow treatment.
Innovation Solution
A resin composition comprising a maleimide compound with a benzene ring and specific molecular weight, an imide compound with hydrocarbon or maleimide groups, and a radical polymerizable compound with a benzene ring and low molecular weight, which when cured, results in a product with low dielectric constant, low dielectric loss tangent, and low thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate materials are used to achieve low relative dielectric constant and low dielectric loss tangent, then signal transmission speed increases, but the materials exhibit high water absorption and high coefficients of thermal expansion leading to warpage and mounting failures
Solution Approach 1:
The invention uses a composite resin system combining polyphenylene ether (PPE) or modified PPE with polyimide (PI) or modified PI, along with cyanate ester (CE) compounds. This multi-component composite approach allows the material to achieve low dielectric properties while simultaneously reducing water absorption and thermal expansion coefficients through synergistic interactions between the different polymer matrices.
Solution Approach 2:
The invention modifies the chemical structure and composition parameters of the resin system by incorporating specific ratios of PPE (10-50 parts), PI (30-70 parts), and CE (5-20 parts), along with controlled amounts of fillers and additives. These parameter adjustments optimize the balance between dielectric performance, moisture resistance, and thermal stability.
2Reliability
If resin composition is optimized for low dielectric constant and low dielectric loss tangent, then signal transmission performance improves, but resistance to water absorption and environmental changes deteriorates
Solution Approach 1:
The cyanate ester-modified polyimide system creates a cross-linked composite network that is inherently resistant to water penetration. The CE groups react with hydroxyl groups in the PI structure to form triazine rings, creating a dense cross-linked matrix that prevents water molecules from disrupting the dielectric properties, thereby maintaining stable dielectric constant and loss tangent values even in humid conditions.
Solution Approach 2:
The invention utilizes the reactive cyanate ester groups to convert potential hydrolysis sites in the polyimide structure into stable cross-linked triazine linkages. This transformation turns the vulnerable points that would normally absorb water into strong, water-resistant cross-links, thereby converting a potential weakness into a strength for environmental stability.
Data Source
AI summary
A resin composition contains a maleimide compound (A) having a benzene ring in the molecule and a maleimide equivalent of 500 g/mol or less; an imide compound (B) having at least one of a hydrocarbon group or a maleimide group at the molecular end; and a radical polymerizable compound (C) having a benzene ring to which an alkenyl group is bonded in the molecule and a weight average molecular weight of 1,000 or less.