Maleimide Resin Composition for PCB Thermal Stability
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Solution Overview
Problem
Current copper-clad laminates and resin compositions used in their preparation do not adequately address the challenges of higher thermal decomposition temperature, lower percent of thermal expansion in Z-axis, lower reflow shrinkage-stretch rate, higher flexural modulus, and lower storage modulus decay rate, which are critical for advanced printed circuit board (PCB) packaging technology.
Innovation Solution
A resin composition comprising 100 parts by weight of a maleimide resin, 30 to 120 parts by weight of a compound of Formula (1), and 3 to 20 parts by weight of a compound of Formula (2), where Formula (1) includes cyclophosphazene compounds with specific vinylphenoxy groups and Formula (2) includes unsaturated C=C double bond-containing groups, is used to create articles such as prepregs, resin films, laminates, and printed circuit boards with improved properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional resin compositions are used, then general characteristics of copper-clad laminates are maintained, but thermal decomposition temperature is insufficient and storage modulus decay rate is high
Solution Approach 1:
The patent uses a composite resin system combining maleimide resin with cyanate ester resin and phosphorus-containing compound, creating a multi-component material that achieves both high thermal decomposition temperature and low storage modulus decay rate through synergistic effects of different resin systems
Solution Approach 2:
The patent modifies the chemical composition parameters by incorporating specific ratios of cyanate ester resin (10-50 parts) and phosphorus-containing compounds (1-10 parts) per 100 parts of maleimide resin, optimizing the molecular structure to achieve superior thermal stability and reduced modulus decay
2Reliability
If existing copper-clad laminates are used, then basic insulation and conduction functions are provided, but thermal expansion in Z-axis is too high for advanced PCB packaging
Solution Approach 1:
The patent reduces Z-axis thermal expansion by modifying the resin composition parameters, specifically using maleimide resin with cyanate ester and phosphorus compounds, achieving thermal expansion of 700 ppm or less through optimized molecular crosslinking and reduced free volume in the cured resin system
3Ease of manufacture
If conventional materials are used, then general processability is achieved, but reflow shrinkage-stretch rate is too high for advanced packaging requirements
Solution Approach 1:
The patent reduces reflow shrinkage-stretch rate by optimizing the resin crosslinking density and molecular structure through the maleimide-cyanate ester-phosphorus compound system, achieving shrinkage-stretch rate of 180 ppm or less while maintaining good manufacturability through controlled curing characteristics
4Strength
If standard resin compositions are used, then basic mechanical support is provided, but flexural modulus is insufficient for high-frequency signal transmission
Solution Approach 1:
The patent enhances flexural modulus by combining maleimide resin with cyanate ester resin and phosphorus-containing compounds, creating a composite system with superior stiffness and dimensional stability that supports high-frequency signal transmission with characteristic impedance control
Data Source
AI summary
A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of a maleimide resin; (B) 30 to 120 parts by weight of a compound of Formula (1); and (C) 3 to 20 parts by weight of a compound of Formula (2). The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including thermal decomposition temperature, percent of thermal expansion in Z-axis, reflow shrinkage-stretch rate, flexural modulus and storage modulus decay rate.