Circuit Board Structure With Removable Molybdenum Oxidation Layer

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Solution Overview

Problem

Existing circuit board structures require cumbersome and costly processes to remove protective layers with strong chemical and structural stability, leading to increased production costs and complexity.

Innovation Solution

The use of a molybdenum layer as a protective layer to prevent oxidation of circuit patterns, which can be easily removed using flux, reducing the need for etching and surface treatment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional protective layers with strong chemical and structural stability are used, then oxidation protection is effective, but removal requires cumbersome and costly etching processes

Engineering Contradiction:

Improveoxidation protection effectivenessVSAvoidprotective layer removal process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs a magnesium-based protective layer that is intentionally designed to be easily removable through simple flux treatment rather than complex etching processes. This disposable approach allows the protective layer to serve its oxidation prevention function during manufacturing, then be easily eliminated without requiring costly or time-consuming removal steps, directly resolving the contradiction between effective protection and ease of removal.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Reliability

If traditional protective layers are used, then oxidation protection is provided, but production time and cost increase due to multiple processing steps

Engineering Contradiction:

Improvecircuit pattern protectionVSAvoidmanufacturing efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The magnesium-based protective layer is designed to be temporarily applied during manufacturing to protect circuit patterns from oxidation, then easily removed using simple flux treatment. This eliminates the need for multiple processing steps including etching and surface treatment, thereby reducing production time and increasing manufacturing efficiency while maintaining adequate protection during the critical manufacturing phases.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the chemical composition parameters of the protective layer by using magnesium-based materials with specific compositional ranges (Mg: 60-90 wt%, Al: 5-30 wt%, Si: 0-10 wt%). These parameter changes enable the protective layer to provide sufficient oxidation protection during manufacturing while being easily removable through flux treatment, thus improving productivity without sacrificing protection effectiveness.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces process complexity and production costs by effectively protecting circuit patterns while allowing for simpler and more efficient manufacturing processes.

Implementation Method 1

The first molybdenum layer is disposed on the copper layer or the second end of the redistribution layer

Methodology Applied

Scientific EffectOxidation prevention: Oxidation

Implementation Method 2

these protective layers can be removed using an etching process

Methodology Applied

Scientific EffectChemical etching:

Data Source

PatentUS20260025920A1Circuit board structure

Publication Date: 2026.01.22 UNIMICRON TECH CORP

AI summary

A circuit board structure is provided. The circuit board structure includes a base layer, a redistribution layer, a copper layer, and a first molybdenum layer. The redistribution layer penetrates the base layer and has a first end and a second end. The copper layer is disposed on the first end of the redistribution layer. The first molybdenum layer is disposed on the copper layer or the second end of the redistribution layer.