Thermosetting Resin Composition for High-Speed PCBs

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Solution Overview

Problem

The composition of modified maleimide resin and thermoplastic elastomer in combination faces challenges with heat resistance under severe conditions for high-density packaging and multilayer configurations in printed wiring boards, particularly due to insufficient compatibility and poor heat resistance after water absorption.

Innovation Solution

A thermosetting resin composition is developed, incorporating a modified maleimide resin with specific structure, a thermoplastic elastomer, and a copolymer resin formed from aromatic vinyl compounds and carboxylic acid anhydrides, with a modified siloxane having an amino group, to enhance heat resistance, low thermal expansion, and dielectric characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a modified maleimide resin and thermoplastic elastomer are used in combination, then dielectric characteristics are improved, but heat resistance after water absorption deteriorates

Engineering Contradiction:

Improveheat resistance after water absorptionVSAvoidcompatibility between resin components

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent introduces a silane-coupled inorganic filler as an intermediary component that mediates between the modified maleimide resin and thermoplastic elastomer. The silane coupling agent on the filler surface creates compatible interfaces between these two resin systems, improving overall compatibility while maintaining heat resistance after water absorption. This resolves the contradiction by using a third component to bridge the incompatibility between the two resin types.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a composite material system combining modified maleimide resin, thermoplastic elastomer, and silane-coupled inorganic filler. This composite approach allows the system to achieve both improved dielectric characteristics (from the elastomer) and maintained heat resistance (from the maleimide resin and silane coupling), while the inorganic filler network provides structural stability that enhances compatibility between the organic resin components.

Inventive Principle:

Principle #40Composite materials

2Stability of the object's composition

If an inorganic filler is added at a high filling rate to reduce thermal expansion, then thermal expansion rate is reduced, but insulation reliability and adhesion deteriorate

Engineering Contradiction:

Improvethermal expansion rateVSAvoidinsulation reliability and adhesion

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The patent changes the surface parameters of the inorganic filler by applying silane coupling agents. This surface modification alters the chemical and physical properties of the filler interface, enabling better adhesion to the resin matrix while maintaining the low thermal expansion benefit. The silane layer creates a gradient in properties from the filler core to the resin interface, resolving the contradiction between thermal expansion control and adhesion maintenance.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves excellent heat resistance, low thermal expansion, and low dielectric loss tangent, improving the performance of printed wiring boards and high-speed communication-compatible modules by enhancing compatibility and resistance to water absorption.

Implementation Method 1

A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2)

Methodology Applied

Scientific EffectAddition reaction: Chemical Bonding

Implementation Method 2

C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride

Methodology Applied

Scientific EffectCopolymerization: Chemical Bonding

Implementation Method 3

a method of using both a modified maleimide resin and a thermoplastic elastomer has been proposed (for example, see PTL 4). In PTL 4, a thermoplastic elastomer is applied for the purpose of reducing the cure shrinkage of the resin

Methodology Applied

Scientific EffectThermal contraction: Thermal Contraction

Data Source

PatentEP3467038B1Thermosetting resin compositin, prepreg, laminated board, printed wiring board, and high-speed communication-compatible module

Publication Date: 2023.09.06 RESONAC CORP

AI summary

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.