Basalt Fiber Multilayer PCBs for High-Temperature Use and Recycling

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Solution Overview

Problem

Glass fiber fabric-based printed circuit boards (PCBs) have significant environmental impacts due to energy-intensive production processes, non-renewable raw materials, and challenging recycling/disposal issues, leading to electronic waste accumulation.

Innovation Solution

Replace glass fiber with basalt fiber, derived from volcanic rock, to create a PCB using basalt fiber fabric and epoxy resin, which is more sustainable, recyclable, and has improved mechanical and electrical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If glass fiber fabric is used in PCB fabrication, then excellent electrical and mechanical properties are achieved, but environmental impact increases due to energy-intensive production and non-renewable materials

Engineering Contradiction:
Improveelectrical and mechanical propertiesVSAvoidenvironmental impact
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the material parameter from glass fiber to basalt fiber, which has comparable or superior mechanical and electrical properties while being derived from renewable volcanic rock. This substitution maintains PCB performance while dramatically reducing environmental impact and energy consumption during production

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite material structure using basalt fiber fabric combined with epoxy resin, similar to traditional glass fiber PCBs. This composite approach ensures that the new material achieves the necessary mechanical strength and electrical insulation properties required for PCB applications while being more environmentally sustainable

Inventive Principle:
Principle #40Composite materials

2Strength

If glass fiber fabric is used in PCB fabrication, then structural integrity is maintained, but recycling and disposal become challenging leading to electronic waste accumulation

Engineering Contradiction:
Improvestructural integrityVSAvoidrecycling and disposal
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The patent changes the fiber material parameter from glass to basalt, which has comparable tensile strength and structural properties. The basalt fiber-based PCB maintains the same structural integrity as glass fiber PCBs while being more amenable to recycling processes due to the natural origin and chemical composition of basalt

Inventive Principle:
Principle #35Parameter changes

3Object-affected harmful factors

If basalt fiber is used instead of glass fiber, then environmental sustainability improves, but manufacturing process complexity may increase

Engineering Contradiction:
Improveenvironmental sustainabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent changes the fiber material parameter from glass to basalt, which has comparable or superior mechanical and electrical properties while being derived from renewable volcanic rock. This substitution maintains PCB performance while dramatically reducing environmental impact and energy consumption during production

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent follows the established manufacturing process for glass fiber PCBs, using the same epoxy resin impregnation, layering, and curing techniques. This copying of proven manufacturing methods minimizes process complexity while achieving the same structural and electrical outcomes with the new basalt fiber material

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Basalt fiber PCBs reduce environmental impact, offer better mechanical properties, higher temperature resistance, and easier recycling, while maintaining comparable electrical performance to glass fiber PCBs.

Implementation Method 1

impregnating the basalt fiber fabric with an epoxy resin

Methodology Applied
Scientific EffectAbsorption: Absorption (physical)

Implementation Method 2

The basalt fiber fabric and the epoxy resin is compression cured

Methodology Applied
Scientific EffectCuring: Phase Change

Data Source

PatentUS12402249B2Eco-friendly printed circuit board for high temperature and low temperature applications
Publication Date: 2025.08.26 SANDISK TECHNOLOGIES LLC
  • US12402249B2 patent drawing
  • US12402249B2 patent drawing
  • US12402249B2 patent drawing

AI summary

A multi-layer printed circuit board (PCB) is fabricated using basalt fibers instead of glass fibers. Using basalt fibers in lieu of glass fibers makes the PCB more environmentally friendly without sacrificing mechanical and electrical properties. The multi-layer PCB includes a basalt fiber core comprised of a basalt fiber prepreg provided between two copper layers. A first copper layer and a second copper are coupled to different sides of the basalt fiber core. A first basalt fiber prepreg is coupled to the first copper layer and a second basalt fiber prepreg is coupled to the second copper layer.