Liquid Metal Composite Interconnects for Flexible Circuits
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Solution Overview
Problem
Conventional Ga-based liquid metals used in flexible circuits suffer from low viscosity, high surface tension, and poor wettability on substrates like silicon, limiting their application in manufacturing deformable electronic devices.
Innovation Solution
A composition comprising a first metal material, such as gallium indium alloy, and a filler material, like indium tin oxide, is used to enhance viscosity and wettability, allowing for the formation of interconnects that maintain electrical communication under strain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional Ga-based liquid metals are used in flexible circuits, then electrical conductivity and thermal conductivity are improved, but viscosity is reduced and wettability deteriorates
Solution Approach 1:
The patent uses eutectic gallium indium (EGaIn) alloy combined with functional fillers (such as metal oxides, polymers, or ceramic particles) to create a composite material. This composite maintains the excellent electrical conductivity of the liquid metal while the filler particles improve wettability on substrates like silicon and enable higher viscosity for better printability in additive manufacturing processes
2Adaptability or versatility
If conventional Ga-based liquid metals are used in flexible circuits, then stretchability is improved, but surface tension increases and wettability deteriorates
Solution Approach 1:
The liquid metal composite incorporates filler materials that reduce surface tension and improve wettability while maintaining the stretchability provided by the fluidic properties of the EGaIn alloy base material
Solution Approach 2:
The patent modifies the physical and chemical parameters of the liquid metal by adjusting filler concentration, particle size, and composition to achieve optimal balance between surface tension, wettability, and stretchability for flexible circuit applications
3Reliability
If conventional Ga-based liquid metals are used in additive manufacturing, then printability is limited due to low viscosity, but electrical conductivity is maintained
Solution Approach 1:
The functional fillers increase the viscosity of the liquid metal composite to appropriate levels for additive manufacturing processes, enabling better shape retention during printing while the continuous liquid metal phase maintains electrical conductivity
Solution Approach 2:
The patent optimizes viscosity parameters through filler addition to enable the material to be successfully deposited and shaped in additive manufacturing processes while maintaining other critical properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of interconnects that maintain electrical conductivity even under significant strain, facilitating the rapid and repeated deformation of flexible electronic devices.
Implementation Method 1
The composition is configurable in order control a viscosity of the composition and/or a wettability of the composition
Implementation Method 2
the composition of the present disclosure remains in a region of elastic deformation when a forced is applied including a stretchability as the pristine liquid metal
Data Source
AI summary
The present disclosure provides systems, methods, and devices for producing an interconnect. A method of manufacturing an electronic device includes forming a first circuit component at a first portion of a deformable substrate. The method further includes forming a second circuit component at a second portion of the deformable substrate. Additionally, the method includes electronically coupling the first circuit component and the second circuit component with a composition. The composition includes a first metal material further including a first weight percent (w %) of the composition. the first metal material is gallium indium alloy, gallium tin alloy, gallium indium tin alloy, gallium indium tin zinc alloy, or a combination thereof. The composition includes a filler material disposed within the first metal material. The filler material includes a second w % of the composition. Accordingly, the method forms an interconnect between the first circuit component and the second circuit component.