Insulating Resin Composition for Thermally Conductive Metal Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing technologies for electronic devices fail to address the challenges of providing a resin composition that is capable of forming an electrically insulating layer with high thermal conductivity, high solder heat resistance, and low elasticity, while also ensuring favorable workability during application and drying without causing flow unevenness or swelling during coating, and bubble formation, and low elasticity, while maintaining excellent electrically insulating and thermally conductive properties for on-vehicle electronic parts.
Innovation Solution
A thermosetting resin composition comprising a rubber-like polymer compound with a glass transition temperature of −40° C. or lower and a weight average molecular weight between 8,000 to 50,000, an epoxy resin, a filler, and a phenoxy resin, which is applied to a metal substrate using a vacuum press to form a metal-based substrate with improved adhesion and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a silicone resin with high water repellency is used as a base for the insulating layer, then adhesiveness to metal substrate is improved, but coating unevenness occurs on the metal body
Solution Approach 1:
The patent introduces a specific rubber-like polymer compound as an intermediary material between the silicone resin base and the metal substrate. This polymer compound has glass transition temperature of -40°C or lower and weight average molecular weight of 8,000 to 50,000, which mediates between the high water repellency of silicone resin and the need for uniform coating on metal surfaces, preventing coating unevenness while maintaining adhesiveness
Solution Approach 2:
The patent changes the molecular weight parameter of the rubber-like polymer compound to a specific range (8,000 to 50,000) and controls its glass transition temperature (-40°C or lower). These parameter changes optimize the balance between coating flowability (preventing unevenness) and adhesion to metal substrate, resolving the contradiction between adhesiveness and coating uniformity
2Use of energy by moving object
If a rubber-like polymer compound with large molecular weight is used, then adhesiveness is improved, but bubbles form during application and drying
Solution Approach 1:
The patent precisely controls the molecular weight parameter of the rubber-like polymer compound within the range of 8,000 to 50,000. This parameter optimization ensures that the polymer has sufficient adhesiveness while maintaining appropriate viscosity and bubble release characteristics during application and drying processes, preventing bubble formation
3Ease of operation
If the insulating layer has high elasticity, then coating workability is improved, but solder cracks occur
Solution Approach 1:
The patent controls the glass transition temperature of the rubber-like polymer compound to be -40°C or lower, which optimizes the elasticity parameter of the insulating layer. This ensures the layer has sufficient flexibility for coating workability while maintaining appropriate rigidity after curing to prevent solder cracks, resolving the contradiction between workability and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a resin composition with high insulating and thermal conductivity, solder heat resistance, and low elasticity, ensuring favorable workability during coating and preventing unevenness or bubble formation, suitable for on-vehicle electronic parts.
Implementation Method 1
a rubber-like polymer compound (A) having a glass transition temperature (Tg) of −40° C. or lower and a weight average molecular weight (Mw) in a range of 8,000 to 50,000
Implementation Method 2
a thermosetting resin composition comprising a rubber-like polymer compound (A), an epoxy resin (B), a filler (C), and a phenoxy resin (D)
Implementation Method 3
heating and pressurizing the resin-attached metal foil and the metal substrate with a vacuum press
Implementation Method 4
a filler (C)
Data Source
AI summary
An object of the present invention is to provide a resin composition having high electrically insulating properties, high thermally conductive properties, low elasticity, and high solder heat resistance as an electrically insulating layer for a metal-based base material to be used for electronic devices, especially for on-vehicle electronic devices, and having favorable workability during coating a body to be coated as a resin composition for an electrically insulating layer before being cured. The present invention provides a thermosetting resin composition, a cured product, and a resin-attached metal foil, each containing a rubber-like polymer compound (A) having a glass transition temperature (Tg) of −40° C. or lower and a weight average molecular weight (Mw) in a range of 8,000 to 50,000, an epoxy resin (B), a filler (C), and a phenoxy resin (D). The present invention also provides a method for producing a metal-based substrate having any one of the thermosetting resin composition, the cured product, and the resin-attached metal foil, and a method for producing an electronic part using the metal-based substrate.