Multicomponent Alloy Capacitor Layer Without Annealing
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Solution Overview
Problem
Conventional capacitor structures in semiconductor devices require annealing treatments for binary metal layers, which can cause damage and instability, increasing manufacturing complexity and cost due to the need for precise temperature, time, and atmosphere control.
Innovation Solution
A multicomponent-alloy material layer with four to six metal elements, comprising specific metal element compositions and ratios, is developed to achieve a suitable work function without the need for thermal annealing, simplifying the manufacturing process and enhancing thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If annealing treatment is performed on binary metal layer to adjust work function, then work function becomes suitable for capacitor structure, but variations in other layers occur including chemical deterioration and physical embrittlement
Solution Approach 1:
The patent changes the compositional parameters by transitioning from binary metal layers to multicomponent alloy layers containing 4-6 metal elements with specific content ratios. This compositional parameter change enables the material to inherently achieve the required work function range (4.3-4.7 eV) without requiring thermal annealing treatment, thereby avoiding the harmful effects of annealing on other layers.
Solution Approach 2:
The patent employs composite materials by creating multicomponent alloy layers that combine 4-6 different metal elements in specific proportions. This composite structure allows the material to achieve desirable electrical properties (work function) while maintaining thermal stability and avoiding the need for post-deposition annealing treatments that would otherwise be required for binary metal layers.
2Reliability
If thermal treatment is performed on other layers to adjust binary metal layer work function, then work function becomes appropriate, but damages occur to binary metal layer with poor thermal stability
Solution Approach 1:
The patent applies preliminary action by designing the multicomponent alloy composition in advance to inherently possess the required work function characteristics. By pre-configuring the 4-6 metal element composition with specific content ratios during the deposition process, the material achieves the desired work function without requiring subsequent thermal treatment, thereby preserving thermal stability.
Solution Approach 2:
The patent changes material parameters by transitioning from binary to multicomponent alloys, which fundamentally alters the thermal stability characteristics. The specific composition of 4-6 metal elements with controlled ratios provides both the required work function and inherent thermal stability, eliminating the trade-off between work function adjustment and thermal stability maintenance.
3Manufacturing precision
If annealing treatment conditions are strictly controlled to prevent damage, then manufacturing precision is maintained, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the annealing treatment step from the manufacturing process by designing multicomponent alloy layers that achieve the required work function directly after deposition. This removes the complex annealing process with its stringent temperature, time, and atmosphere control requirements, thereby simplifying the overall manufacturing process while maintaining or improving precision.
Solution Approach 2:
The patent replaces the expensive and complex annealing treatment process with a simpler, more cost-effective multicomponent alloy deposition process. By using 4-6 metal elements in specific ratios that inherently provide the required work function, the need for costly thermal processing equipment and precise environmental control is eliminated, reducing manufacturing complexity and cost.
Data Source
AI summary
The present invention relates to a multicomponent-alloy material layer and a method of manufacturing the multicomponent-alloy material layer and a capacitor structure of a semiconductor device comprising the multicomponent-alloy material layer. The multicomponent-alloy material layer has four to six metal elements and has specific two kinds of metal components, and the two kinds of metal components have a specific content ratio, such that without a thermal annealing treatment, the multicomponent-alloy material layer has a specific work function for an application in the capacitor structure of the semiconductor device.