Alternating High and Low Density Layer Structures in Component Carriers

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional component carriers with multilayer structures face high manufacturing costs and accuracy issues due to complex connections and varying fan-out demands, making it difficult to achieve reliable and cost-effective designs with high fan-out performance.

Innovation Solution

A component carrier is designed with alternatingly stacked low density and high density layer structures, where low density structures with fewer conductive elements are used for simplicity and cost-effectiveness, and high density structures with more conductive elements are selectively placed for high fan-out areas, allowing for modular manufacturing and improved reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional multilayer structures with board-in-board technology are used to achieve high fan-out performance, then the fan-out capability is improved, but the manufacturing cost increases and manufacturing precision deteriorates

Engineering Contradiction:
Improvefan-out performanceVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The component carrier is segmented into alternating low density and high density layer structures. The high density layers are selectively positioned to provide fan-out functionality only where needed, while low density layers provide mechanical support and electrical connectivity in areas with lower connection requirements. This segmentation allows the carrier to achieve high fan-out performance in critical areas without incurring the high manufacturing costs associated with conventional multilayer structures throughout the entire carrier.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the component carrier are assigned different structural densities based on their specific functional requirements. High density layer structures are placed in regions requiring high fan-out performance and numerous electronic links, while low density layer structures are used in regions with fewer connections. This local differentiation optimizes manufacturing cost by avoiding the excessive complexity and cost of conventional multilayer structures in areas where they are not needed.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If conventional multilayer structures with board-in-board technology are used to achieve high fan-out performance, then the fan-out capability is improved, but the manufacturing precision and reliability of connections deteriorate

Engineering Contradiction:
Improvefan-out performanceVSAvoidconnection accuracy
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The component carrier is divided into alternating low density and high density layer structures. The high density layers are selectively positioned to provide fan-out functionality only where needed, while low density layers provide mechanical support and electrical connectivity in areas with lower connection requirements. This segmentation allows the carrier to achieve high fan-out performance in critical areas without incurring the high manufacturing costs associated with conventional multilayer structures throughout the entire carrier.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the component carrier are assigned different structural densities based on their specific functional requirements. High density layer structures are placed in regions requiring high fan-out performance and numerous electronic links, while low density layer structures are used in regions with fewer connections. This local differentiation optimizes manufacturing cost by avoiding the excessive complexity and cost of conventional multilayer structures in areas where they are not needed.

Inventive Principle:
Principle #3Local quality

3Reliability

If high density layer structures are used throughout the component carrier to ensure reliable connections, then connection reliability is improved, but the manufacturing cost increases and design complexity increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Different regions of the component carrier are assigned different structural densities based on their specific functional requirements. High density layer structures are placed in regions requiring high fan-out performance and numerous electronic links, while low density layer structures are used in regions with fewer connections. This local differentiation optimizes manufacturing cost by avoiding the excessive complexity and cost of conventional multilayer structures in areas where they are not needed.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Instead of applying high density layer structures throughout the entire component carrier, the invention applies them only partially in regions where high connection reliability is critically needed. This partial application of high density structures achieves the necessary reliability for critical connections while avoiding the excessive manufacturing cost and design complexity that would result from using high density structures everywhere.

Inventive Principle:
Principle #16Partial or excessive action

4Reliability

If high density layer structures are used throughout the component carrier to ensure reliable connections, then connection reliability is improved, but device complexity increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoiddesign complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Different regions of the component carrier are assigned different structural densities based on their specific functional requirements. High density layer structures are placed in regions requiring high fan-out performance and numerous electronic links, while low density layer structures are used in regions with fewer connections. This local differentiation optimizes manufacturing cost by avoiding the excessive complexity and cost of conventional multilayer structures in areas where they are not needed.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Instead of applying high density layer structures throughout the entire component carrier, the invention applies them only partially in regions where high connection reliability is critically needed. This partial application of high density structures achieves the necessary reliability for critical connections while avoiding the excessive manufacturing cost and design complexity that would result from using high density structures everywhere.

Inventive Principle:
Principle #16Partial or excessive action

Data Source

PatentUS10834831B2Component carrier with alternatingly vertically stacked layer structures of different electric density
Publication Date: 2020.11.10 AT & S CHINA
  • US10834831B2 patent drawing
  • US10834831B2 patent drawing
  • US10834831B2 patent drawing

AI summary

A component carrier includes a plurality of low density layer structures, and a plurality of high density layer structures having a higher density of electrically conductive structures than the plurality of low density layer structures, where the low density layer structures and the high density layer structures are alternatingly vertically stacked.