Printed Circuit Assembling TRIZ Cases

Controlled surface roughness on the supporting film enhances underfill filling and mold adhesion while maintaining high resolution.

A radiating component conducts heat from a heat-generating element through a board insertion.

A dry film solder mask composite laminate material uses reversible chemical bonds to enable precise rework positioning.

Curved flexible printed circuit assembly integrates antennas and acoustic seals to resolve housing alignment complexity.

Segmented negative pressure sources prevent leak-induced nozzle instability while reducing device size and cost compared to shared pump systems.

A sinter-bonded heat dissipation structure transfers thermal energy from microelectronic devices to module substrates via low-temperature metallurgical bonding.

A multilayer wiring board combines an anodic oxide film layer for fine-pitch through-holes with a sintered ceramic layer for mechanical strength.

Integrated lead frame tabs and housing recesses provide accurate z-axis positioning for electronic assemblies without printed circuit boards.

Axial lead capacitors feature opposing parallel terminal leads extending from the same axis to enable direct surface mounting.

Folded top-to-bottom interconnects shunt around the package substrate to increase pin density.

A soldering nut features a non-meshing notch that rotates against the screw shaft to scrape adhered flux residues from the threads.

Insulating protrusions extend vertically from the flexible board to separate connecting portions, reducing crosstalk while maintaining fixing strength.

A board distributing apparatus allocates circuit boards to transport lanes based on real-time occupancy status.

A semiconductor bonding jig uses thermal expansion to deform a flexible wiring board and press electrodes together.

A bonding apparatus aligns inclined leads to pads using a rotatable support bracket and tilt unit.

Segmenting the nozzle from the elastic piston reduces removal force, simplifying solder container exchange without complex mechanisms.

Relocating conductive bonding pads to the lower substrate surface eliminates flexible circuit bending radius constraints.

A thermocompression bonding system uses a booster pump to increase cooling fluid pressure for precise temperature control.

Bent solder terminals route electrical connections laterally to reduce mechanical stress on fiber-optic housings.

Segmenting a motherboard into distinct CPU and IO assemblies via high-speed connectors reduces trace length to resolve electromagnetic interference issues.

A modular semiconductor package uses a signal carrying component to form a customizable seal ring around the die.

Automated milling extracts defective flip chips to enable rapid, damage-free replacement without discarding expensive assemblies.

Selective etching removes the handling structure to reduce contamination and improve routing density in microelectronic assemblies.

Tin-silver-indium-bismuth-antimony alloy composition suppresses phase transformation in electronic circuit boards.

Segmented perimeter and cross members counteract CTE mismatches to reduce substrate warpage in large ball grid array packages.

Pre-bending a flexible sacrificial substrate before embedding patterned conductors prevents detachment during stretching.

Alternating high and low density layer structures reduce manufacturing costs while maintaining high fan-out performance.

Direct adhesive bonding eliminates wire bond loops to reduce parasitic inductance above 1 GHz.

Vertical sensor separation reduces spatial constraints, enabling versatile motion tracking in both contact and free-space modes.

Selective solder mask removal creates an air void to alter electrical length, compensating for physical trace differences and eliminating timing skew.

Runner body molding achieves 90% epoxy resin utilization while tin dipping eliminates toxic electroplating emissions.

Embedding conductive traces within the substrate resolves thermal electrical conflicts by enhancing heat dissipation and signal integrity.

Direct laser jetting eliminates photolithography and etching steps, reducing fabrication complexity while enabling precise multi-layer via integration.

Plugging electrodes connect buried IC chips to conductive layers, enabling multi-layer boards with high definition and simplified fabrication processes.

Vacuum dry milling creates precise conductive traces without chemical residues, enabling reliable soldering of components to aluminum circuits.

Segmented modular light boards replace fixed components to resolve adaptability and reliability contradictions in LED luminaires.

Expansion terminal portions extend beyond the circuit board thickness to increase solder joining area, reducing peeling defects caused by environmental stress.

A multiplex winding inductor electrode uses metal pins and boards to lower specific resistance within a compact resin layer.

A support stage with a stepped groove prevents substrate bending during compression, ensuring uniform stress distribution and stable chip attachment.

Steam spraying nozzles evaporate flux impurities via phase transitions, preventing moisture-induced tool deformation and reducing cleaning time.

Thermally conductive vias in a circuit board establish vertical heat pathways, preventing thermal runaway during high-power electrical testing of stacked chips.

Segmenting the optical-electrical converter from the permanent electrical package reduces solder reflow thermal stress and manufacturing costs.

A wiring board uses varied through-hole densities to mitigate thermal expansion and stiffness changes.

A suspension board production method uses pre-formed openings in insulating layers to expose metal boards for direct electrolytic plating.

Trenches on the elastomer side surface prevent upward solder movement, maintaining elastic resilience and ensuring reliable PCB attachment.

Stacked circuit boards with an interposer create a walled interface for dense component packing.

Forming conductive-filled blind holes before lamination ensures precise component alignment, eliminating positioning errors and reducing parasitic effects.