Radiating Component Heat Dissipation in Electronic Modules

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Solution Overview

Problem

There is a demand for miniaturized and lightweight electronic components in portable devices, particularly in mobile devices, where heat management is a significant challenge due to the increasing efficiency and functionality of these devices, and existing technologies struggle to effectively manage heat dissipation in compact designs.

Innovation Solution

An electronic component module is designed with a heat-generating component mounted on a first board, a radiating component inserted into a through-hole component insertion portion, and a second board electrically connected to the first board, utilizing a connection conductor for heat dissipation, where the radiating component is made of a metal block with a configuration that increases its cross-sectional area for enhanced heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple individual devices are integrated into a single package (SiP technology), then device functionality and efficiency are improved, but heat generation increases and thermal management becomes more difficult

Engineering Contradiction:

Improvedevice functionalityVSAvoidheat generation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent divides the package structure into distinct functional layers: a first board for mounting heat-generating components, a radiating component for heat dissipation, and a second board for electrical connection. This segmentation allows each component to perform its specific function optimally while managing heat effectively in the integrated package.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The radiating component acts as an intermediary between the heat-generating component and the external environment. It receives heat from the heat-generating component through thermal conduction and dissipates it to the surroundings, serving as a thermal mediator that protects other components while enabling efficient heat transfer.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Weight of stationary object

If component size is reduced for miniaturization, then portable device weight and size are reduced, but heat dissipation capability deteriorates

Engineering Contradiction:

Improvecomponent weightVSAvoidheat dissipation capability

Core Design Contradiction:

Weight of stationary objectVSTemperature

Solution Approach 1:

The radiating component is strategically positioned directly beneath the heat-generating component, concentrating heat dissipation capability exactly where it is needed. This localized approach ensures optimal thermal management at the heat source without requiring the entire package to be enlarged for cooling purposes.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent utilizes the vertical dimension by inserting the radiating component through a through-hole in the first board, creating a three-dimensional heat dissipation pathway. This allows heat to be conducted downward through the radiating component to the second board, effectively using the Z-axis for thermal management without increasing the footprint area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If radiating component cross section is increased for enhanced heat transfer, then heat dissipation efficiency is improved, but component height increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidcomponent height

Core Design Contradiction:

TemperatureVSLength of moving object

Solution Approach 1:

The radiating component is nested within the package structure by inserting it through a through-hole in the first board and positioning it against the second board. This nesting approach allows the radiating component to utilize the existing package volume without requiring additional external space, maintaining a compact overall profile while providing effective heat dissipation.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for effective heat dissipation from the heat-generating component to the main board, improving thermal management and maintaining a slim profile, even with increased component integration, thereby enhancing the efficiency and reliability of portable devices.

Implementation Method 1

a radiating component inserted into the component insertion portion, and mounted on an active surface of the heat-generating component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11191150B2Electronic component module and method for manufacturing the same

Publication Date: 2021.11.30 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.