Modular Semiconductor Package With Customizable Seal Ring
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Solution Overview
Problem
Conventional semiconductor packages face limitations in temperature tolerance during die attach and pre-processing operations, which restrict the type of dies that can be used and result in increased costs, dimensional tolerances, and lead times due to the use of traditional metal-ceramic packages with a fixed seal ring.
Innovation Solution
A modular semiconductor package design comprising separately fabricated carrier, signal carrying component, and lid, where the signal carrying component forms a customizable seal ring, allowing higher temperature tolerance and eliminating the need for a thick film network and extra wire bonds, enabling individual product customization without substantial redesign.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional metal-ceramic packages with fixed seal ring are used, then structural stability is maintained, but temperature tolerance during die attach and pre-processing operations is limited
Solution Approach 1:
The package is divided into separate modular components: carrier, signal carrying component, and lid. The seal ring function is segmented from the traditional fixed metal-ceramic structure and assigned to the customizable signal carrying component, allowing independent optimization of each module for temperature tolerance and customizability.
Solution Approach 2:
The seal ring transitions from a fixed, static structure to a dynamic, customizable configuration. The signal carrying component can be adapted or reconfigured for different applications, enabling the seal ring to accommodate various temperature requirements and die types without redesigning the entire package.
2Reliability
If traditional metal-ceramic packages are used, then structural integrity is ensured, but device complexity increases due to thick film network and extra wire bonds
Solution Approach 1:
The signal carrying component merges multiple functions into a single element: it provides signal transmission, forms the seal ring, and establishes electrical connections. This eliminates the need for separate thick film networks and extra wire bonds, reducing component count while maintaining structural integrity through the unified design.
Solution Approach 2:
The signal carrying component serves multiple purposes simultaneously: it acts as a signal transmission medium, forms the seal ring structure, and provides electrical interconnections. This multi-functionality reduces the overall device complexity by eliminating redundant components required in traditional packages.
3Manufacturing precision
If traditional packages with fixed seal ring are used, then manufacturing process is standardized, but manufacturing precision decreases due to dimensional tolerances
Solution Approach 1:
The seal ring in the signal carrying component is designed with localized precision features where needed, while other areas maintain manufacturing flexibility. This allows critical dimensional tolerances to be controlled in specific regions without requiring the entire manufacturing process to be overly restrictive, balancing precision with ease of manufacture.
4Productivity
If traditional metal-ceramic packages are used, then thermal stability is maintained, but productivity decreases due to increased lead times
Solution Approach 1:
Dividing the package into modular components (carrier, signal carrying component, lid) enables parallel manufacturing of individual modules, reducing overall lead time. The segmented design allows each component to be fabricated independently and assembled, streamlining the manufacturing process while maintaining thermal stability through proper material selection in each module.
Data Source
AI summary
Embodiments described herein relate generally to a microelectronic packaging and the manufacture thereof. A carrier may have a die attached to a top face thereof. A printed circuit board may be attached to the top face of the carrier. The printed circuit board may have a hole in which the die is disposed. A lid may be attached to the printed circuit board opposite the carrier so that the die is enclosed by the carrier, the printed circuit board, and the lid. The printed circuit board may form a seal ring around the die. Other embodiments may be described and/or claimed.