Buried IC Chip Printed Wiring Board with Plugging Electrodes
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Solution Overview
Problem
Current multi-layer printed wiring boards face challenges in achieving high definition and cost-effectiveness due to complex fabrication processes and alignment precision requirements, leading to increased costs and decreased yields.
Innovation Solution
A printed wiring board configuration featuring an insulating base material with an electric conductive layer and plugging electrodes made of conductive paste, connected to a semiconductor device buried within the base material, along with a supporting board and adhesion layer to suppress warpage and facilitate facile processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a build-up method is used to form re-wiring layers on semiconductor devices, then miniaturization of the package is achieved, but the number of terminals is limited by terminal pitch rules and the application is restricted to devices with a small number of pins
Solution Approach 1:
The patent transitions from planar terminal arrangement to three-dimensional vertical stacking. Multiple wiring layers are stacked in the vertical dimension, allowing terminals to be arranged across multiple levels. This enables a significantly increased number of terminals within the same footprint area, overcoming the terminal pitch limitation of planar designs while maintaining miniaturization.
2Manufacturing precision
If core-less wiring boards are formed by build-up method with fine wirings, then suitability for wafer process devices is improved, but fabrication process costs become very high
Solution Approach 1:
The patent divides the wiring board into modular stacked layers. Each layer can be fabricated and prepared independently, then assembled through lamination. This segmentation allows standard manufacturing processes to be used for each layer, reducing overall fabrication costs compared to forming the entire complex structure in a single expensive build-up process.
Solution Approach 2:
The patent prepares wiring layers and semiconductor devices in advance as separate completed units before final assembly. This preliminary fabrication allows each component to be optimized and manufactured using appropriate standard processes, reducing the complexity and cost of the final integration process.
3Manufacturing precision
If multi-layer boards are formed by stacking wirings with polyimide bases, then highly defined wirings in a layer are achieved, but interlayer connection depends on mechanical positioning precision and via pitch is restricted
Solution Approach 1:
The patent introduces adhesion promoters as intermediary layers between stacked wiring layers. These adhesion promoters provide positioning features and bonding surfaces that facilitate precise alignment during lamination. The intermediaries enable reliable interlayer connections without requiring extremely tight mechanical positioning tolerances, simplifying the manufacturing process.
4Manufacturing precision
If chip built-in board processes are executed in series for each wiring layer, then multi-layer structure is achieved, but fabrication time becomes long and yield decreases due to process accumulation
Solution Approach 1:
The patent merges multiple fabrication processes into parallel operations. Multiple wiring layers are fabricated simultaneously rather than sequentially, and then assembled together in a single lamination step. This combining of processes dramatically reduces total fabrication time and eliminates the yield degradation that occurs with sequential process accumulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the production of multi-layer wiring boards with highly defined components using simplified processes, reducing costs and maintaining high precision, while the supporting board helps in minimizing warpage and enhancing manufacturing efficiency.
Implementation Method 1
an adhesion layer formed on another side of the insulating base material
Data Source
AI summary
A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.According to the invention, therefore, it is allowed to provide a multi-layer printed wing board with highly defined components implemented, allowing for a fabrication by facile processes, without causing, among others, increased costs or decreased yields.