Semiconductor Module Bonding Jig Thermal Deformation

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Solution Overview

Problem

Existing semiconductor module bonding methods face challenges in achieving reliable bonding between flexible wiring boards and semiconductor devices due to issues with pressure distribution and thermal expansion mismatches, leading to potential bonding failures.

Innovation Solution

A semiconductor module design utilizing a laminate substrate with different thermal expansion coefficients, where the flexible wiring board is heated to deform and press its electrode against the semiconductor device's electrode, eliminating the need for external pressure and enhancing bonding reliability using a bi-metal function in the bonding jig.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external pressure is applied during bonding, then bonding reliability is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:

Improvebonding reliabilityVSAvoidbonding process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The wiring board's own thermal expansion properties are utilized to generate the necessary bonding pressure. When heated to solder bonding temperature, the wiring board expands and automatically presses its electrode against the semiconductor device's electrode, eliminating the need for external pressure application mechanisms.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The invention exploits the thermal expansion of the wiring board when heated to solder bonding temperature. This thermal expansion causes the wiring board to bend and press its electrode against the semiconductor device's electrode with appropriate pressure, providing the necessary bonding force without external intervention.

Inventive Principle:

Principle #37Thermal expansion

2Ease of manufacture

If uniform pressure is applied during bonding, then manufacturing simplicity is improved, but bonding precision deteriorates due to thermal expansion mismatches

Engineering Contradiction:

Improvebonding process simplicityVSAvoidelectrode alignment precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The pressure distribution is made non-uniform and localized to the bonding area. The wiring board's thermal expansion naturally concentrates pressure at the electrode contact points where bonding is needed, while other areas experience different pressure levels, optimizing both precision and simplicity.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If simple bonding apparatus is used, then manufacturing cost is reduced, but bonding reliability may deteriorate due to insufficient pressure control

Engineering Contradiction:

Improvemanufacturing costVSAvoidbonding reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The system uses the wiring board's inherent thermal expansion properties to self-generate the necessary bonding pressure, eliminating the need for complex external pressure control mechanisms while maintaining reliable bonding through the natural physical behavior of the materials.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method ensures high bonding reliability and simplifies the manufacturing process by using thermal expansion differences to achieve reliable solder bonding without external force, reducing the likelihood of bonding failures and allowing for cost-effective production with a simple thermal bonding apparatus.

Implementation Method 1

a plurality of substrates with different thermal expansion coefficients are laminated, and the second electrode is pressed against the first electrode by bending/deformation of the wiring board caused by application of heat to a solder bonding temperature and by a difference in the thermal expansion coefficients of the plurality of substrates

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

the bonding jig has a bi-metal function of bending and deforming the wiring board being held by the bonding jig when heated

Methodology Applied

Scientific EffectBi-metal function: Bi-Metallic Strip

Data Source

PatentUS9881890B2Semiconductor module, bonding jig, and manufacturing method of semiconductor module

Publication Date: 2018.01.30 OLYMPUS CORPORATION(JP)

AI summary

A semiconductor module includes an image pickup device on which a bump is disposed, and a flexible wiring board having a flexible resin as a base and including a wire having a bonding electrode at a distal end portion solder-bonded to the bump, in which the bonding electrode is pressed against the bump by bending/deformation of the wiring board caused by application of heat to a solder bonding temperature.