Thermocompression Bonding System with Booster Pump Cooling
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Solution Overview
Problem
Conventional thermocompression bonding systems face challenges in rapidly heating and cooling semiconductor elements during the bonding process, which affects machine throughput and the quality of electrical interconnections due to temperature control limitations and pressure drops in cooling fluid channels.
Innovation Solution
A thermocompression bonding system with a bond head assembly that includes a heater, a fluid path for cooling fluid, a pressurized cooling fluid source, a booster pump to increase fluid pressure, and a control valve to manage the cooling fluid flow, allowing for precise temperature control and enhanced cooling efficiency through variable cooling rates and increased fluid pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the heater is used to heat the semiconductor element quickly to improve machine throughput, then the bonding speed increases, but the temperature control becomes difficult because the heater must be at different temperatures at different times/locations
Solution Approach 1:
The cooling system is segmented into multiple zones with independent control. The bond head assembly includes multiple cooling channels that can be controlled independently, allowing different temperatures at different locations and times during the bonding process
Solution Approach 2:
The cooling fluid pressure is made dynamically adjustable through the booster pump and control valve. The system can rapidly change cooling intensity during the bonding process, enabling quick transitions between heating and cooling phases to improve throughput while maintaining temperature control
2Productivity
If conventional cooling fluid pressure is used, then the system is simple, but the cooling efficiency is insufficient leading to slower cooling rates and reduced machine throughput
Solution Approach 1:
The system uses a booster pump to increase cooling fluid pressure and a control valve to regulate flow. This hydraulic system enables rapid cooling by forcing cooling fluid through the bond head assembly at controlled high pressures, significantly improving cooling rates
Solution Approach 2:
The cooling fluid pressure parameter is changed from conventional low pressure to high pressure through the booster pump. This parameter change enables much faster cooling rates while the control valve allows precise adjustment to optimize the balance between cooling speed and system stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves faster cooling and more consistent temperature control, improving the quality of electrical interconnections and increasing machine throughput by ensuring precise temperature management during the bonding process.
Implementation Method 1
a bond head assembly including a heater for heating an semiconductor element to be bonded
Implementation Method 2
the bond head assembly including a fluid path configured to receive a cooling fluid
Data Source
AI summary
A thermocompression bonding system for bonding semiconductor elements is provided. The thermocompression bonding system includes (1) a bond head assembly including a heater for heating an semiconductor element to be bonded, the bond head assembly including a fluid path configured to receive a cooling fluid; (2) a pressurized cooling fluid source; (3) a booster pump for receiving a pressurized cooling fluid from the pressurized cooling fluid source, and for increasing a pressure of the received pressurized cooling fluid; (4) a pressurized fluid reservoir for receiving pressurized cooling fluid from the booster pump; and (5) a control valve for controlling a supply of pressurized cooling fluid from the pressurized fluid reservoir to the fluid path.