Passive Component Integration in Substrate via Conductive Blind Holes
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Solution Overview
Problem
The integration of passive components into substrates is hindered by positioning errors, which affect the electrical connection and yield of electronic devices, especially in high-frequency circuit designs where parasitic effects are significant.
Innovation Solution
A manufacturing method that involves forming positioning blind holes in the circuit layer, filling them with adhesive conductive material, and then positioning and laminating the passive component to ensure accurate electrical connection before the laminating step, thereby preventing positioning errors and enhancing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the passive component is laminated within the substrate and then the substrate is drilled for electrical connection, then the manufacturing process can be simplified, but positioning errors occur affecting electrical connection and yield
Solution Approach 1:
The patent applies preliminary action by forming positioning blind holes and filling them with conductive material in the circuit layer before laminating the passive component. This pre-positioning ensures that when the passive component is later laminated, it aligns precisely with the conductive material, eliminating positioning errors and ensuring accurate electrical connection without compromising manufacturing simplicity
2Productivity
If the position of drilling is predetermined, then the manufacturing process can proceed efficiently, but if the passive component position is not accurate, the electrical connection cannot be achieved
Solution Approach 1:
The patent performs preliminary positioning by creating blind holes and filling them with conductive material before the lamination step. This ensures that the passive component will automatically align with the conductive material during lamination, guaranteeing reliable electrical connection while maintaining manufacturing efficiency through a streamlined process flow
Solution Approach 2:
The conductive material filled in the positioning blind holes serves as an intermediary element between the circuit layer and the passive component. It provides both mechanical positioning guidance and electrical connection functionality, ensuring that even with predetermined drilling positions, the electrical connection remains reliable through the adaptive alignment provided by the conductive material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures precise positioning and electrical connection of passive components, reducing parasitic effects and improving the process yield by allowing for accurate integration of passive components within the substrate.
Implementation Method 1
forming a conductive material in the positioning blind hole; positioning the passive component to the positioning blind hole of the circuit layer and electrically connecting the passive component to the circuit layer via the conductive material in the positioning blind hole
Data Source
AI summary
A manufacturing method for integrating a passive component within a substrate is disclosed. The manufacturing method comprises the steps of: providing a circuit layer, wherein a positioning blind hole is formed in the circuit layer; forming a conductive material in the positioning blind hole; positioning the passive component in the positioning blind hole of the circuit layer and electrically connecting the passive component to the circuit layer via the conductive material in the positioning blind hole; and laminating a core layer, the passive component, and the circuit layer as the substrate.