Interposer Circuit Board Assembly for Compact Device Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Modern smart electronic devices face challenges in accommodating an increasing number of components without increasing the overall form factor, as consumers desire smaller devices with longer battery life and enhanced features.
Innovation Solution
The use of stacked circuit board assemblies with an interposer circuit board positioned between a first and a second circuit board, allowing for the dense packing of electronic components within a walled interface or outside it, while maintaining access to electronic circuit interface components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more electronic components are added to enhance device functionality, then the feature set and capability of the device are improved, but the device form factor and size increase
Solution Approach 1:
The patent transitions from a planar circuit board layout to a three-dimensional stacked configuration with multiple circuit boards positioned at different heights (first circuit board at a first height, second circuit board at a second height). This vertical stacking enables additional components to be integrated without increasing the horizontal footprint of the device, effectively resolving the contradiction between enhanced functionality and compact size.
Solution Approach 2:
The patent implements a nested arrangement where circuit boards and components are positioned within and around each other in a compact configuration. The first and second circuit boards are arranged in close proximity with components nested between them, maximizing space utilization and enabling high component density within a small form factor.
2Volume of moving object
If components are densely packed to reduce device size, then the device form factor is reduced, but access to interface components for maintenance and integration becomes difficult
Solution Approach 1:
The patent divides the electronic system into separate modular circuit boards (first circuit board, second circuit board) that can be independently accessed and maintained. This segmentation allows interface components to be reached from different sides and directions, facilitating ease of maintenance and integration while maintaining compact overall dimensions.
Solution Approach 2:
By stacking circuit boards in three dimensions rather than arranging them in a single plane, the patent creates multiple access paths to interface components. Components can be accessed from top, bottom, and side directions, maintaining serviceability while achieving compact form factor through vertical integration.
Data Source
AI summary
An electronic device includes a first circuit board, a second circuit board, and an interposer circuit board. The interposer circuit board defines a walled interface mechanically attaching the first circuit board to the second circuit board. One or more electronic circuit components are positioned within the walled interface and are mechanically attached to one of the first circuit board or the second circuit board. An electronic circuit interface component is mechanically attached to the first circuit board outside the walled interface. The electronic circuit interface component is electronically coupled to the one or more electronic circuit components.