Axial Lead Capacitor Module for PCB Bridging

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing capacitors with terminal leads that extend in a single direction or at a small angle face challenges in bridging multiple printed circuit boards (PCBs) without risking damage or increased inductance, leading to inefficient space usage and potential arcing issues.

Innovation Solution

The development of axial lead capacitors with terminal leads extending in opposing parallel directions, allowing for efficient bridging of PCBs without bending, which reduces inductance and prevents arcing, and a manufacturing process using a tape and reel system with resin coating to optimize lead orientation and spacing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If terminal leads extend in a single direction or at a small angle, then the capacitor structure is simpler to manufacture, but the capacitor cannot efficiently bridge multiple PCBs and risks damage or increased inductance

Engineering Contradiction:
Improvecapacitor structure simplicityVSAvoidbridging capability between PCBs
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent inverts the conventional lead arrangement by extending terminal leads in opposite parallel directions rather than in a single direction or at small angles. This inversion enables the capacitor to bridge multiple PCBs effectively while maintaining manufacturing simplicity through standardized processes.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent transitions from planar lead arrangements (single direction or small angles) to a three-dimensional opposite parallel configuration. This dimensional change allows leads to extend along the same axis in opposite directions, optimizing space utilization and reducing inductance while maintaining ease of manufacture.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If terminal leads are bent to fit PCB layouts, then the capacitor can adapt to different configurations, but inductance increases and damage risk increases

Engineering Contradiction:
ImprovePCB configuration adaptabilityVSAvoidinductance and damage resistance
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

Instead of bending leads to adapt to PCB layouts, the patent inverts the approach by having leads extend in opposite parallel directions from the outset. This eliminates the need for bending while maintaining adaptability to different PCB configurations through proper lead orientation.

Inventive Principle:
Principle #13The other way round (Inversion)

3Volume of moving object

If lead spacing is reduced to improve compactness, then space efficiency improves, but arcing risk increases

Engineering Contradiction:
Improvecapacitor compactnessVSAvoidarcing risk
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent optimizes lead spacing by having leads extend in opposite parallel directions along the same axis. This spatial arrangement allows for reduced overall capacitor volume while maintaining adequate lead separation to prevent arcing, achieving compactness without compromising electrical safety.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9859057B2Capacitor module
Publication Date: 2018.01.02 APPLE INC
  • US9859057B2 patent drawing
  • US9859057B2 patent drawing
  • US9859057B2 patent drawing

AI summary

This application includes multiple embodiments related to capacitors. In some embodiments, capacitors are set forth as having terminal leads that extend in parallel and opposing axial directions. The embodiments discussed herein relate to a capacitor module including one or more anodized pellets for providing a charge storage within the capacitor module. The capacitor module can be configured as a surface mounted or non-surface mounted capacitor module. The capacitor module can include an array of anodized pellets arranged in multiple rows or columns of anodized pellets connected by conductive trace included in the capacitor module. In a non-surface mounted embodiment of the capacitor module, the capacitor module can include cathode and anode connections that are exclusively on the side surfaces of the capacitor module.