Removable Handling Structure for TSV Fabrication

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Solution Overview

Problem

Current interposer technologies require further improvement in terms of manufacturing efficiency and precision, particularly in forming metalized structures and redistribution layers for effective electrical connectivity in microelectronic assemblies.

Innovation Solution

A method involving the formation of metalized structures through a support material layer with a handling structure and insulating layer, where metalized vias and slots are created by etching, allowing for precise electrical connections and redistribution layers, with the etch rate of the support material being significantly higher than the insulating layer to minimize contamination and enhance routing density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a handling structure is used to support the support material layer during processing, then manufacturing precision and stability are improved, but device complexity and contamination risk increase

Engineering Contradiction:

ImproveprecisionVSAvoidcomplexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The handling structure is designed to be removable from the support material layer after processing. The insulating layer is etched away to release the handling structure, allowing it to be separated and removed from the support material layer, thereby reducing device complexity in the final product while maintaining its support function during manufacturing

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The insulating layer serves as an intermediary material that temporarily bonds the handling structure to the support material layer during processing. This intermediary layer allows for precise positioning and support during manufacturing, then can be selectively removed to release the handling structure without damaging other components

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the insulating layer is etched to remove the handling structure, then productivity is improved by enabling structure separation, but manufacturing precision may be affected by etching uniformity

Engineering Contradiction:

ImproveproductivityVSAvoidprecision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The etching process is designed to be selective, etching the insulating layer at specific locations where the handling structure needs to be removed while leaving other insulating regions intact. This localized etching approach enables efficient structure separation while maintaining precision in areas where the insulating layer is needed

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The etching process utilizes differences in material properties (etch selectivity) between the insulating layer and other materials in the structure. By controlling etching parameters such as chemistry, temperature, and duration, the process achieves both high productivity through complete handling structure removal and high precision through selective etching that spares other critical structures

Inventive Principle:

Principle #35Parameter changes

3Reliability

If metalized structures are formed extending through the support material layer, then connectivity and functionality are improved, but contamination risk increases

Engineering Contradiction:

ImproveconnectivityVSAvoidcontamination

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The handling structure, while adding complexity, serves as a protective element during processing that prevents contamination of the support material layer and metalized structures. The structure can be removed cleanly after serving its protective function, converting the potential harm of added complexity into a benefit of reduced contamination

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the creation of interconnection components with high routing density and precise electrical connectivity, reducing contamination levels and improving the efficiency of microelectronic assembly processes.

Implementation Method 1

The method also includes etching at least a portion of the insulating layer to remove the handling structure from the in-process unit

Methodology Applied

Scientific EffectEtching:

Implementation Method 2

forming openings through the thickness of the support material layer by processing applied to the support material layer from above the first surface and from above the second surface thereof. Forming the metalized structures can further include depositing a metal within the openings

Methodology Applied

Scientific EffectMetal deposition: Deposition (physical)

Data Source

PatentUS8978247B2TSV fabrication using a removable handling structure

Publication Date: 2015.03.17 ADEIA SEMICON TECH LLC

AI summary

A method for forming an interconnection element having metalized structures includes forming metalized structures in an in-process unit that has a support material layer with first and second spaced-apart surfaces defining a thickness therebetween, a handling structure, and an insulating layer separating at least portions of the first surface of the support material layer from at least portions of the handling structure. The metalized structures are formed extending through the thickness of the support material layer. The method also includes etching at least a portion of the insulating layer to remove the handling structure from the in-process unit and further processing the in-process unit to form the interconnection element.