Laser-Assisted Deposition for PCB Fabrication
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Solution Overview
Problem
Current methods for fabricating printed circuit boards (PCBs) are complex and time-consuming, involving multiple stages and limitations in miniaturization due to the need for through-hole drilling and soldering, which restricts the integration of complex and flexible electronic components.
Innovation Solution
A laser-assisted deposition (LAD) system that prints flowable materials directly onto a substrate, including metal and epoxy layers, using jetting, sintering, and curing to form PCB structures, allowing for single-sided or double-sided PCBs with embedded electronics, and reduces the need for through-hole drilling by using vias that are not fully penetrating, enabling efficient and precise fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional lithography and etching methods are used to fabricate PCBs, then conductive lines can be formed on the substrate, but the manufacturing process becomes complex and time-consuming with multiple stages required
Solution Approach 1:
The patent extracts and eliminates unnecessary intermediate steps from the conventional PCB fabrication process. By using direct laser-assisted deposition to write conductive lines, the method removes the need for photolithography, photoresist application, etching, and multiple cleaning stages, achieving direct patterning of conductive traces in a single step
Solution Approach 2:
The patent replaces mechanical and chemical fabrication systems with a laser-based system. Instead of using mechanical drilling, chemical etchants, and physical photoresist processing, the invention uses laser energy to directly deposit and sinter conductive materials, substituting thermal and optical fields for mechanical and chemical processes
2Reliability
If through-hole drilling and soldering are performed to enable conduction between multilayer boards, then electrical connections can be established, but the area required for components increases, limiting miniaturization
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional vertical integration by depositing conductive lines through vias that penetrate multiple layers. This allows electrical connections to be made in the vertical dimension rather than requiring lateral space for solder joints and component leads, enabling true miniaturization through multi-layer stacking
Solution Approach 2:
The patent implements nested conductive structures where conductive lines are deposited within vias that pass through multiple PCB layers. The conductive material is nested within the via holes, and multiple such nested structures are stacked vertically to create complex three-dimensional electrical interconnections, maximizing space utilization
3Adaptability or versatility
If flexible substrates are used to enable stretchable and bendable electronics, then conformability to curved surfaces is achieved, but the structural integrity and electrical conductivity become difficult to maintain under strain
Solution Approach 1:
The patent uses flexible substrates as the base structure and deposits thin film conductive layers directly onto them using laser-assisted deposition. The thin film nature of the deposited conductive material allows it to conform to substrate deformation without breaking, maintaining electrical continuity while enabling bending and stretching capabilities
Solution Approach 2:
The patent creates composite structures by depositing conductive materials (such as metal particles or conductive polymers) onto flexible substrate surfaces. This composite approach combines the flexibility of the polymer substrate with the electrical conductivity of the deposited material, achieving both mechanical compliance and electrical functionality in a single integrated structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the PCB production process, reduces production time and costs, and enables the creation of complex and flexible PCBs with improved miniaturization capabilities by eliminating the need for extensive drilling and soldering, facilitating the integration of electronic components on a single side or both sides of the board.
Implementation Method 1
A laser-assisted deposition (LAD) system that prints flowable materials directly onto a substrate
Implementation Method 2
using jetting, sintering, and curing to form PCB structures
Data Source
AI summary
Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.