Fiber-Optic Component Soldering with Bent Terminals
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Solution Overview
Problem
Fiber-optoelectronic components with fiber-optical interfaces are sensitive to heat and thermal stresses during reflow soldering, making it difficult to solder them onto circuit boards, and existing SMD interfaces face mechanical stress and limitations in transmitting high signal frequencies.
Innovation Solution
The arrangement features bent solder connection elements extending laterally from the housing, soldered to the conductor track carrier, with a characteristic impedance matching coating or filling material in the gap between the housing and track carrier, reducing mechanical stress and reflections, and includes slotted solder connection elements for improved mechanical flexibility and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reflow soldering is used to mount fiber-optic components, then electrical connections are established, but the fiber-optic interfaces are damaged due to heat sensitivity
Solution Approach 1:
The solder connection is segmented into two separate stages: first the housing is soldered to the conductor carrier, then the optoelectronic component is mounted separately. This segmentation allows the housing to withstand soldering temperatures while the sensitive fiber-optic interfaces are protected from direct thermal exposure.
Solution Approach 2:
The housing is pre-soldered to the conductor carrier before the optoelectronic component is mounted. This preliminary action creates a stable mechanical base that protects the subsequent component mounting from thermal stresses, as the sensitive fiber-optic interfaces are not exposed to reflow soldering temperatures.
2Reliability
If SMD technology is used to solder components onto conductive traces, then electrical connections are established, but mechanical stress damages the electrical interface due to thermal expansion differences
Solution Approach 1:
The housing base is designed with locally different mechanical properties: a rigid support section for stable mounting and a play section with intentional clearance to absorb thermal expansion stresses. This local differentiation allows the electrical interface to withstand temperature variations without mechanical damage.
Solution Approach 2:
A play section with intentional clearance is built into the housing base design before assembly. This clearance acts as a cushion that absorbs mechanical stresses from thermal expansion, protecting the solder joints and electrical interface from damage during temperature variations.
3Ease of manufacture
If conventional SMD interfaces are used, then component mounting is simplified, but signal frequencies of 20 GHz or more cannot be transmitted
Solution Approach 1:
The solder terminals are designed with curved paths instead of straight connections. This curvature optimizes the electromagnetic field distribution and reduces signal reflections, enabling high-frequency signal transmission of 20 GHz or more while maintaining the simplicity of surface-mount technology.
Solution Approach 2:
The solder terminals are designed with specific geometric parameters including curved paths and optimized dimensions. These parameter changes transform the conventional SMD interface into a high-frequency capable connection that can transmit signals at 20 GHz or more while retaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high signal frequencies of 20 GHz or more and reduces mechanical stress, allowing for reliable soldering of fiber-optoelectronic components while minimizing signal interference and reflections.
Implementation Method 1
The curved section of the solder terminal reduces reflections, making the electrical interface suitable for signal frequencies of 20 GHz or more
Implementation Method 2
Furthermore, the housing base has a base support section that rests directly on the conductor carrier, and the housing has at least one mounting section that is screwed to the conductor carrier. Preferably, the gap between the base termination section and the conductor carrier is at least partially filled with a material whose relative dielectric constant is greater than 1
Implementation Method 3
with their other end 130 the solder terminal elements 100 are soldered onto the conductor tracks 90
Data Source
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AI summary
The invention relates, among other things, to an assembly (10), comprising an electric conductive track carrier (20) and a component (30) arranged on the conductive track carrier. According to the invention, the component is a fiber-optoelectronic component and comprises: a housing (40), at least one electro-optic or optoelectronic component (50), at least one fiber-optic interface (60) connected to the electro-optic or optoelectronic component, and at least one electric interface (80) for connecting the component to the conductive track carrier, wherein the electric interface comprises at least one bent electric soldered connection element (100), the one end (110) of which is attached to a bottom connection section (120) of the housing bottom (125) and from there extends laterally outwardly such that the other end (130) of the soldered connection element – as viewed from above – protrudes laterally and is laterally soldered to the conductive track carrier outside of the outer housing contour (140), and wherein the soldered connection element is bent away from the bottom connection section such that the bottom connection section has a distance (A) from the conductive track carrier.