EMI Shielding Gasket Soldering Prevention Trenches

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Solution Overview

Problem

EMI shielding gaskets for surface mount technology face challenges in maintaining elastic resilience and preventing solder cream from moving upward during the reflow process, leading to reduced elastic force and potential soldering failures.

Innovation Solution

Incorporating trenches or recesses on the side and bottom surfaces of the elastomer, or a soldering prevention layer on the side surface, to prevent solder cream from moving upward and ensuring secure soldering while maintaining elastic resilience.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If solder cream is applied to the EMI shielding gasket for surface mount, then the gasket can be attached to the printed circuit board, but the solder cream moves upward along the side surface during reflow process, causing the side surface to be soldered and reducing elastic resilient force

Engineering Contradiction:

Improvesoldering reliabilityVSAvoidelastic resilient force

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The side surface of the EMI shielding gasket is segmented into multiple regions through trenches or recesses, creating distinct zones that control solder cream flow. This segmentation prevents solder cream from uniformly spreading across the side surface, thereby preventing unwanted soldering while maintaining the gasket's elastic properties.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the EMI shielding gasket are given different properties: the bottom surface has high solderability for secure attachment, while the side surfaces have controlled solderability through trenches or recesses to prevent unwanted soldering. This local differentiation allows the gasket to achieve both reliable attachment and maintained elasticity.

Inventive Principle:

Principle #3Local quality

2Reliability

If the amount of solder cream is increased to prevent soldering defects, then soldering reliability improves, but the cost increases

Engineering Contradiction:

Improvesoldering reliabilityVSAvoidsolder cream amount

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

Trenches or recesses are pre-formed on the EMI shielding gasket before the soldering process. This preliminary structural preparation guides the solder cream flow during reflow, ensuring that solder cream remains in the intended area without requiring excessive amounts of solder cream, thus preventing defects while controlling costs.

Inventive Principle:

Principle #10Preliminary action

3Volume of moving object

If the EMI shielding gasket is miniaturized for surface mount technology, then device size is reduced, but maintaining high electrical conductivity, excellent soldering properties, high heat resistance, and excellent elastic resilient characteristics becomes more difficult

Engineering Contradiction:

Improvegasket sizeVSAvoidperformance characteristics

Core Design Contradiction:

Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The EMI shielding gasket employs local quality differentiation where the bottom surface is optimized for soldering and electrical conductivity, while the side surfaces are structured with trenches or recesses to maintain elasticity and prevent unwanted soldering. This localized optimization allows the miniaturized gasket to maintain all required performance characteristics despite reduced overall size.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The EMI shielding gasket utilizes composite material properties, combining elastomeric materials with conductive materials in specific regions. This composite approach allows the miniaturized gasket to simultaneously achieve high electrical conductivity, excellent soldering properties, high heat resistance, and excellent elastic resilient characteristics.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents solder cream from being soldered to the side surfaces, ensuring reliable attachment and maintaining the elastic resilient force of the EMI shielding gasket, thus enhancing the reliability of the surface mount process and reducing defects.

Implementation Method 1

a soldering prevention part disposed in at least one region of a side surface and a bottom surface of the elastomer

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Implementation Method 2

a conductive layer disposed in at least one region of the elastomer

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS8907229B2EMI shielding gasket

Publication Date: 2014.12.09 INNOCHIPS TECH

AI summary

Provided is an electromagnetic interference shielding gasket, which includes an elastomer, a soldering prevention part disposed in at least one region of a side surface and a bottom surface of the elastomer, and an electrode disposed on the bottom surface of the elastomer. Even when solder cream for attaching the EMI shielding gasket to a printed circuit board is pushed from the bottom surface of the EMI shielding gasket by its surface tension and solder-rising, the solder cream stays in the soldering prevention part without moving upward along the side surface of the EMI shielding gasket. Accordingly, the reliability of soldering can be ensured without sacrificing elastic resilient force of the EMI shielding gasket.