Display Substrate Bonding with Bending Prevention Groove
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Solution Overview
Problem
Conventional bonding methods for chip-on-glass (COG) processes in OLED displays often result in bending of thin, flexible display substrates due to uneven stress distribution, leading to unstable compression and potential connection issues during the bonding of driving chips.
Innovation Solution
A bonding apparatus with a compression means and a support stage that includes a bending prevention mechanism, such as a stepped groove or opening, to stabilize the display substrate and prevent bending during chip bonding, ensuring uniform compression and secure attachment of driving chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used to bond driving chips to display substrates, then the bonding process can be completed, but the thin display substrate bends due to uneven stress distribution
Solution Approach 1:
The patent introduces a support stage with a localized support structure (protrusion or groove) positioned at the lower portion of the display substrate. This local structural modification provides targeted support to prevent bending at critical areas during compression, while maintaining the overall flexibility and functionality of the substrate. The support structure is strategically placed to counteract the bending caused by chip bonding without affecting other substrate properties.
Solution Approach 2:
The support stage acts as an intermediary element between the compression means and the display substrate. It mediates the compression force by distributing it uniformly across the substrate while preventing direct contact that would cause bending. The support stage absorbs and redistributes the mechanical stress, protecting the substrate from deformation during the bonding process.
2Strength
If compression force is applied to bond the driving chip, then secure attachment is achieved, but the substrate bends due to concentrated stress
Solution Approach 1:
The support stage is segmented into distinct functional regions: a support surface for substrate placement, a protrusion or groove structure for localized support, and integration with the compression means. This segmentation allows each region to perform its specific function - the support surface provides a base, the protrusion/groove prevents bending, and the compression means applies force. The segmented design enables uniform stress distribution while maintaining bonding strength.
Solution Approach 2:
The patent modifies the physical parameters of the support stage, including the depth, width, and position of the protrusion or groove structure. These parameter adjustments optimize the support effectiveness in preventing substrate bending while maintaining the necessary compression force for bonding. By tuning these geometric parameters, the system achieves the right balance between bonding strength and substrate stability.
3Shape
If the display substrate is made thinner to improve display quality, then aesthetic appearance improves, but the substrate becomes more prone to bending during bonding
Solution Approach 1:
The support stage is prepared in advance with the protrusion or groove structure positioned at the lower portion of the display substrate before the bonding process begins. This preliminary configuration ensures that when compression force is applied during bonding, the substrate already has the necessary support structure in place to prevent bending. The support stage is pre-positioned to counteract the bending tendency inherent in thin substrates before the bonding stress is applied.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate bending and ensures stable chip bonding, maintaining the integrity of the display panel by evenly distributing stress and enhancing the bonding process, even with substrates thinner than 0.3 mm.
Implementation Method 1
an anisotropic conductive film provided between the display substrate and the driving chip
Implementation Method 2
a compression means provided in an upper portion of the display substrate and compressing the driving chip
Implementation Method 3
a compression heat where a heat source may be provided
Data Source
AI summary
A display panel that includes: a display substrate; a driving chip bonded onto the display substrate; an anisotropic conductive film provided between the display substrate and the driving chip; and a protection film attached to a bottom of the display substrate, and the protection film is provided with a bending prevention means.