Alternating PCB Pad Terminals for Uniform Display Bonding
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Solution Overview
Problem
Existing display devices face challenges in minimizing differences in bonding characteristics between pad terminals of a printed circuit board (PCB) and a display substrate, leading to non-uniform press force and potential inaccuracies in signal transmission.
Innovation Solution
The implementation of a display device design where the PCB is bonded to a display substrate with alternately arranged first and second sub-pad terminals, some connected through contact holes and others directly, to reduce bonding characteristic variations and enable direct probe testing without separate test terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If all pad terminals are connected through contact holes, then electrical connection is achieved, but manufacturing complexity and bonding characteristic variations increase
Solution Approach 1:
The patent applies local quality by creating two distinct types of pad terminals with different connection methods: first pad terminals connected through contact holes and second pad terminals directly exposed. This local differentiation allows each type to serve specific functions while reducing overall bonding characteristic variations across the PCB surface.
Solution Approach 2:
The patent segments the pad terminal population into two groups: those requiring contact hole connections and those requiring direct connections. This segmentation enables differentiated bonding approaches for different terminal types, improving overall bonding uniformity while maintaining reliable electrical connections for all terminals.
2Difficulty of detecting and measuring
If separate test terminals are provided, then PCB testing is enabled, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent makes the pad terminals serve dual functions: they provide both electrical connection for signal transmission and serve as test terminals for PCB testing. By eliminating the need for separate dedicated test terminals, the design reduces device complexity while maintaining full testing capability through direct probe contact with the pad terminals.
3Area of stationary object
If pad terminals are positioned close together, then area is reduced, but bonding characteristic differences increase due to non-uniform press force
Solution Approach 1:
The patent applies local quality by creating two distinct types of pad terminals with different connection methods: first pad terminals connected through contact holes and second pad terminals directly exposed. This local differentiation allows each type to serve specific functions while reducing overall bonding characteristic variations across the PCB surface.
Data Source
AI summary
A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.