Printed Circuit Assembling TRIZ Cases

A standoff interposer provides electrical pathways between circuit boards while establishing required Z-height spacing.

A xerographic micro-assembler manipulates charge-encoded micro-objects to sort and orient components on a substrate.

Segmented adhesive layers and solder openings couple the conductive shield to the ground, resolving EMI interference while maintaining manufacturing precision.

An asymmetric level difference between convex portions prevents solder fillet short-circuits during high-density mounting.

Optimized tin-silver-copper solder alloy composition suppresses voids generation while maintaining excellent wettability and fatigue resistance.

Selective chemical dissolution replaces mechanical window removal to prevent component damage and increase manufacturing yield.

Outer layer substrate slits prevent chemical intrusion and thickness irregularities by enabling accurate terminal exposure during multi-layer board assembly.

Local reinforcement prevents substrate deformation from frictional heat, ensuring reliable component attachment without compromising overall flexibility.

Optimized ceramic interposer thickness and electrode orientation suppress audible noise transmission to circuit boards while maintaining low mounting height.

Latching pins shift angle via pinch tabs to enable secure insertion and easy removal from crowded circuit boards without permanent soldering.

A circuit module uses a conductive film on sealing resin to dissipate heat from embedded devices.

Bonded mid-plate structures unify the plate and ring to maintain structural integrity while reducing device weight.

An electric loop through a conductive adhesive film confirms bonding integrity, bypassing visual inspection limits caused by the black matrix shielding layer.

A semiconductor device uses cored solder balls as connection terminals and antenna elements within a stacked board architecture.

Magnetic field cures anisotropic conductive adhesive into isolated parallel paths.

Segmented carrier holds flex geometry during reflow, preventing component shift and flattening.

Embedding printhead dies in a molded PCB substrate routes fluid through vertical channels to reduce manufacturing complexity.

Rectangular PTC device uses lateral bonding sections to secure components onto circuit boards without dedicated soldering areas.

A capacitor component with a buffer member having insulating properties and conductive fibers penetrating through it.

Adjusting negative pressure flow rate by nozzle suction port size resolves low pressure difference issues in small diameter nozzles.

A MELF electronic component mounts into a metal pattern receiving portion on an insulating substrate.

Asymmetric tapered contact surfaces prevent solder bridging between adjacent pads, enabling higher connection density on miniaturized sensor assemblies.

Insulating protrusions on circuit board lands prevent solder cracks and short circuits by maintaining sufficient solder thickness under thermal stress.

Inverting the sequence by placing components first and drilling holes subsequently resolves alignment precision issues while maintaining production efficiency.

A blind hole exposes an embedded sensor surface through laser drilling followed by selective etching.

Galvanic tin alloy coating with silver or bismuth suppresses whisker growth, preventing short circuits in automotive electronics.

Alternating contact-hole and direct sub-pad terminals on a printed circuit board reduce bonding characteristic variations across the display substrate.

A reciprocating plunger applies inertial force to liquid material without contacting the valve seat.

Retention bosses and adhesive layers stabilize a printed circuit board in a connector socket, preventing disconnections under shock and vibration.

A contact component features a flange with a concave portion to concentrate solder volume at the junction interface.

Merging flexible and rigid substrates simplifies the fabrication process while enhancing thermal stability of solder joints in battery protection circuits.

A correction amount calculation device selects target components with minimal reflow movement to determine positional deviation.

Adhesive bonding reduces distance between circuit board and backlight module, minimizing frame size while through holes relieve stress at bending corners.

Suction mechanism lifts inner lid after ejection to prevent paste drops, resolving reliability issues with uncontrolled flow.

A flux management system removes vaporized contaminants from wave solder machine tunnels using a two-stage condensation and filtration process.

A reusable hot pressing stage uses detachable support sub-devices to securely hold printed circuit boards during manufacturing.

Dogbone contact pads reduce termination capacitance on paddle cards.

Partial substrate grooves prevent burr formation during cutting, eliminating green resist and ensuring accurate device placement.

A reflow furnace conveyance rod adjusts substrate support rail spacing through reciprocating motion.

Integrating conductive particles into the encapsulant eliminates separate housings, reducing module volume while blocking electromagnetic interference.

A moving discharge member deposits sealing agent along electrical connecting portions to ensure complete coverage on liquid ejection heads.

Single supplying unit serves multiple nozzle spindles while adjustable intervals accommodate varying component pitches.

Cantilever pads flex to absorb thermal expansion stresses, preventing solder joint cracks caused by coefficient of thermal expansion mismatches.

A board positioning method uses two independent stopping units to constrain substrate edges at fixed positions within separate mounting stages.

Active soldering chemically bonds metal pins to ceramic substrates, eliminating mechanical instability from conventional soft soldering.

Segmented conductive wires attenuate electromagnetic interference between RF inductors while preserving high Q factors.

A composite circuit board integrates a thermal interface material layer between conductive structures and a metal substrate.

A circuit assembly uses plate-shaped conductive members and fixed relay members to create flat terminal surfaces for electronic components.

Automated electronic sensors replace manual tonometry to eliminate corneal thickness errors and infection risks.