Conductive Encapsulant for 360-Degree EMI Shielding
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Solution Overview
Problem
Conventional encapsulated electronic circuit assemblies face challenges with size increase due to non-integral conductive housings, limited electromagnetic interference (EMI) shielding, and susceptibility to moisture and contaminants, while approaches without housings either lack EMI shielding or increase module size with external leads.
Innovation Solution
An electronic module design featuring a top and bottom plate with a circuit board in between, encapsulant, and a continuous conductive coating surrounding the entire assembly for integral EMI shielding, allowing components on both sides of the board and minimizing module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a pre-formed conductive housing is used to encapsulate the circuit assembly, then EMI shielding is provided, but the module size increases due to wall thickness and spacing requirements
Solution Approach 1:
The patent merges the encapsulant and EMI shielding functions into a single integrated structure. The encapsulant itself is made conductive through the addition of conductive particles, eliminating the need for a separate conductive housing. This integration removes the additional wall thickness and spacing that would be required for a separate housing, thereby reducing overall module size while maintaining EMI shielding effectiveness.
Solution Approach 2:
The patent uses composite materials by incorporating conductive particles (such as metal flakes, spheres, or fibers) into the encapsulant matrix. This creates a composite encapsulant that simultaneously provides mechanical protection, environmental sealing, and EMI shielding properties. The conductive particles form a network within the encapsulant that blocks electromagnetic interference without requiring additional structural elements.
2Object-affected harmful factors
If a bathtub-configured housing is used for encapsulation, then some EMI shielding is provided, but shielding is limited to five sides only
Solution Approach 1:
The patent makes the encapsulant itself conductive, allowing it to perform multiple functions simultaneously: mechanical protection, environmental sealing, and complete 360-degree EMI shielding. The conductive encapsulant replaces the bathtub housing entirely, providing universal protection on all sides including the bottom, which the traditional five-sided bathtub configuration could not achieve. This eliminates the need for additional bottom shielding structures.
Solution Approach 2:
The patent combines the encapsulant and EMI shielding into a single integrated component. Rather than having separate structures for encapsulation and shielding, the conductive encapsulant performs both functions simultaneously, providing complete EMI protection on all surfaces including the bottom of the module, thereby achieving full 360-degree shielding coverage.
3Volume of moving object
If the circuit assembly is encapsulated and then cut to size, then housing is eliminated, but external leads are required which increases module dimensions
Solution Approach 1:
The patent merges the encapsulant and EMI shielding functions into a single integrated structure. The encapsulant itself is made conductive through the addition of conductive particles, eliminating the need for a separate conductive housing. This integration removes the additional wall thickness and spacing that would be required for a separate housing, thereby reducing overall module size while maintaining EMI shielding effectiveness.
Solution Approach 2:
The patent uses composite materials by incorporating conductive particles (such as metal flakes, spheres, or fibers) into the encapsulant matrix. This creates a composite encapsulant that simultaneously provides mechanical protection, environmental sealing, and EMI shielding properties. The conductive particles form a network within the encapsulant that blocks electromagnetic interference without requiring additional structural elements.
4Object-affected harmful factors
If a conductive coating is applied to provide complete EMI shielding, then EMI protection is improved, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates conductive particles into the encapsulant material before the encapsulation process. This preliminary incorporation ensures uniform distribution of conductive elements throughout the encapsulant, eliminating the need for subsequent coating operations. The conductive properties are built into the material itself during mixing, simplifying the manufacturing process while achieving complete EMI shielding effectiveness.
Solution Approach 2:
The patent combines the encapsulant and EMI shielding into a single integrated component. Rather than having separate structures for encapsulation and shielding, the conductive encapsulant performs both functions simultaneously, providing complete EMI protection on all surfaces including the bottom of the module, thereby achieving full 360-degree shielding coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides comprehensive EMI shielding, reduces module size, and protects against environmental factors like moisture and cleaning sprays, enabling higher component density and direct connection of components to the shield.
Implementation Method 1
a continuous conductive coating surrounding the top plate, the circuit board, the encapsulant, and at least a portion of the bottom plate. The conductive coating is in electrical connection with the circuit board and the bottom plate
Implementation Method 2
an encapsulant disposed between the top plate and the circuit board and between the bottom plate and the circuit board
Data Source
AI summary
Electronic module with all-sided electromagnetic interference (EMI) shielding and methods of making same. The electronic module includes an encapsulated circuit board between a top plate and a conductive bottom plate, electrical leads extending from the circuit board through the bottom plate, and a continuous conductive coating substantially covering the entire electronic module except for a bottom surface of the bottom plate. The conductive coating forms direct, independent connections at least to the circuit board and the bottom plate. The conductive coating provides EMI shielding across the top and sides of the electronic module. The conductive bottom plate provides EMI shielding across the bottom of the electronic module. Methods of manufacturing include encapsulating a circuit board between a top plate and bottom plate, separating materials from the encapsulated circuit board to expose conductive traces on the circuit board and bottom plate, and coating the sawed device with a conductive coating.