Circuit Module Heat Dissipation via Conductive Sealing Resin

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Solution Overview

Problem

Communication module FEMs face challenges in efficiently dissipating heat produced by devices like power amplifiers, which can damage the devices and affect other components, while existing solutions like three-dimensional metallization are costly and reduce module size.

Innovation Solution

A circuit module design featuring a substrate with a conductive material film and sealing resin portion, where the conductive material portion connects to the film, allowing for efficient heat dissipation from embedded devices without the need for additional space or increased cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If three-dimensional metallization is used to dissipate heat, then heat dissipation efficiency is improved, but manufacturing cost increases and module size increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The sealing resin portion itself serves as the heat dissipation structure by forming a conductive path to the heat-generating device, eliminating the need for separate three-dimensional metallization structures. The sealing resin is configured to contact the device and extend to the outer surface, creating an integrated heat dissipation solution that reduces both cost and complexity

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The sealing resin portion performs multiple functions: it provides electrical insulation, mechanical sealing, and heat dissipation. By making the sealing resin conductive or providing a conductive path through it, the same structural component serves both protective and thermal management functions, avoiding additional heat dissipation structures

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If three-dimensional metallization is used to dissipate heat, then heat dissipation efficiency is improved, but module size increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmodule size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The heat dissipation function is merged with the sealing resin portion, which is already required for electrical insulation and mechanical protection. The conductive path is formed within or through the existing sealing structure, eliminating the need for separate heat dissipation components and reducing overall module size

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conductive path for heat dissipation is nested within the sealing resin portion structure. The sealing resin is configured to extend from the heat-generating device to the outer surface of the module, utilizing the existing spatial arrangement and avoiding additional volume consumption

Inventive Principle:

Principle #7Nested doll (Nesting)

3Reliability

If devices are embedded in sealing resin, then device protection is improved, but heat dissipation becomes difficult

Engineering Contradiction:

Improvedevice protectionVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The sealing resin is configured with different properties in different regions: it provides electrical insulation and protection in most areas, but creates a conductive path or contacts the device directly in specific regions to enable heat dissipation. This localized differentiation allows both protection and thermal management functions to coexist

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The sealing resin portion acts as an intermediary between the heat-generating device and the external environment. By configuring the sealing resin to extend to the outer surface and provide a conductive path, it mediates heat transfer from the device while maintaining its protective and insulating functions

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables effective heat dissipation from devices within the module, reducing the risk of damage and size constraints while maintaining cost-effectiveness.

Implementation Method 1

The conductive material film covers a side of the sealing resin portion... the conductive material portion is connected to the conductive material film on the side of the sealing resin portion... enables efficient dissipation of the heat produced from an embedded device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10741465B2Circuit module and method of manufacturing the same

Publication Date: 2020.08.11 MURATA MFG CO LTD

AI summary

A circuit module (301) includes a first substrate (201), a first module (101), a sealing resin portion (3), and a conductive material film (7). The first substrate (201) has a first principal surface (201a). The first module (101) is mounted on the first principal surface (201a). The sealing resin portion (3) is formed on the first principal surface (201a) and covers the first module (101). The conductive material film (7) covers a side of the sealing resin portion (3). The first module (101) includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film (7) on the side of the sealing resin portion (3).