Laminated Capacitor Substrate Vibration Damping
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Solution Overview
Problem
Laminated capacitors in electronic components generate audible noise due to mechanical distortion when mounted on circuit substrates, which is exacerbated by increased capacitor size, and existing solutions like thickening the interposer increase mounting height, contradicting the goal of reducing equipment thickness.
Innovation Solution
A substrate-type terminal with an insulating inorganic substrate main body having a specific thickness and Young's modulus, combined with a laminated capacitor, where the internal electrodes are perpendicular to the mounting surface, and groove portions are provided to reduce vibration transmission, effectively preventing audible noise while minimizing mounting height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the interposer is thickened to reduce distortion transmission and suppress audible sound, then the audible noise is reduced, but the mounting height increases which contradicts the goal of reducing equipment thickness
Solution Approach 1:
The patent applies parameter changes by precisely controlling the thickness and Young's modulus of the interposer substrate. Instead of simply thickening the interposer, the invention optimizes specific parameters (thickness: 0.05-0.4mm, Young's modulus: 100-400 GPa) to achieve the right balance between distortion suppression and height reduction. This allows the interposer to effectively reduce audible noise while maintaining a compact mounting height suitable for thin electronic equipment.
Solution Approach 2:
The patent employs composite materials by selecting substrates with specific mechanical properties (inorganic materials with controlled Young's modulus in the range of 100-400 GPa). The use of composite or specially formulated materials allows the interposer to achieve optimal vibration damping characteristics without increasing thickness, thereby suppressing audible noise while maintaining low mounting height.
2Power
If the capacity of the laminated capacitor is increased to meet higher electrical demands, then the electrical performance is improved, but the distortion increases leading to more audible sound generation
Solution Approach 1:
The patent addresses this contradiction by changing the mechanical parameters of the interposer substrate. By optimizing the thickness and Young's modulus of the substrate, the invention compensates for the increased distortion generated by high-capacity capacitors. The specific parameter ranges (thickness: 0.05-0.4mm, Young's modulus: 100-400 GPa) are designed to suppress vibration transmission even when larger capacitors are used, allowing high electrical performance without excessive audible noise.
3Object-affected harmful factors
If a substrate-type terminal is introduced to suppress audible sound, then the noise reduction is achieved, but the device complexity increases
Solution Approach 1:
The patent applies universality by designing the interposer substrate to perform multiple functions simultaneously: it provides electrical connection between the capacitor and circuit board, mechanically supports the capacitor, suppresses vibration transmission to reduce audible noise, and maintains proper positioning. By integrating these multiple functions into a single component, the invention reduces overall device complexity compared to using separate components for each function.
Solution Approach 2:
The interposer substrate serves as an intermediary component between the laminated capacitor and the circuit board. It mediates the mechanical and electrical interaction between these two components, absorbing and dampening vibrations while maintaining electrical connectivity. This intermediary approach effectively reduces audible noise without requiring direct modification of either the capacitor or the circuit board, thereby managing device complexity efficiently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces audible noise from circuit substrates and maintains a low mounting height by using a ceramic substrate with a high Young's modulus and strategically oriented internal electrodes, enhancing vibration absorption and stability.
Implementation Method 1
The substrate main body includes an inorganic material and has a Young's modulus of more than or equal to 100 GPa and less than or equal to 400 GPa... effectively preventing audible noise while minimizing mounting height... enhancing vibration absorption and stability
Implementation Method 2
a slight mechanical distortion occurs due to a change in applied voltage. The distortion may be transmitted to the circuit substrate, and an audible sound may be generated
Data Source
AI summary
An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces or prevents vibration being transmitted to a circuit substrate on which it is mounted.