Multi-Layer Circuit Board Exposure via Outer Substrate Slits
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Solution Overview
Problem
The conventional method of manufacturing multi-layer circuit boards faces challenges in aligning materials accurately, leading to potential chemical intrusion and irregularities in the outer layer substrate, which increases costs and reduces yield, while also making it difficult to form minute circuits due to insufficient pressure during stacking.
Innovation Solution
The method involves forming slits in the outer layer substrate to conform to the inner layer circuit exposure portion, using exfoliating paper or a mask material to ensure accurate stacking and exposure, and peeling off the substrate with the remaining paper or mask material to prevent chemical intrusion and ensure flatness, thereby improving yield and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If stacking is performed after forming the opening in the interlayer adhesive layer, then the opening can be formed to expose the terminal portion, but the overall substrate thickness at the opening portion becomes small resulting in insufficient pressure during stacking and irregularity in the outer layer substrate
Solution Approach 1:
The invention forms the opening in the outer layer substrate before stacking the inner and outer layer substrates. This preliminary action allows the opening to be prepared in advance, enabling subsequent stacking to proceed with proper pressure distribution across the entire substrate surface, including the opening portion, thereby preventing thickness irregularities while achieving the desired terminal exposure.
Solution Approach 2:
The invention divides the substrate into regions with different thickness characteristics by forming an opening in the outer layer substrate. This segmentation allows the opening portion to be treated differently from the rest of the substrate, enabling selective exposure of the terminal portion while maintaining proper stacking pressure in the remaining areas.
2Ease of manufacture
If alignment of materials is performed during actual manufacturing, then the multi-layer circuit board can be assembled, but alignment accuracy becomes difficult to achieve resulting in chemical intrusion risk and reduced yield
Solution Approach 1:
The invention forms the opening in the outer layer substrate before stacking, which serves as a pre-formed alignment reference. This preliminary formation of the opening structure provides a fixed geometric feature that facilitates accurate alignment during the stacking process, reducing the difficulty of achieving precise material alignment and thereby preventing chemical intrusion while maintaining ease of assembly.
3Ease of operation
If the interlayer adhesive layer is attached after stacking, then the terminal portion can be exposed, but chemical intrusion into the terminal portion cannot be reliably prevented
Solution Approach 1:
The invention forms the opening in the outer layer substrate before stacking the inner and outer layer substrates. This preliminary opening formation creates a physical barrier structure that prevents chemical intrusion into the terminal portion during subsequent etching and processing operations, while still allowing the terminal portion to be exposed through the opening after assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the flatness of the outer layer substrate, prevents chemical intrusion during outer layer circuit formation, and improves the yield of multi-layer circuit boards by ensuring accurate exposure of the inner layer circuit at a lower cost.
Implementation Method 1
peeling off and thereby removing the exfoliating paper other than a residual exfoliating paper
Implementation Method 2
stacking and curing the inner layer substrate and the outer layer substrate such that an inner layer circuit side of the inner layer substrate and an adhesive layer side of the outer layer substrate face one another
Data Source
AI summary
A multi-layer circuit board having a connector portion of an inner layer substrate being exposed, the multi-layer circuit board comprising: an inner layer substrate in which an inner layer circuit is formed, the inner layer circuit including the connector portion; and an outer layer substrate having an outer layer circuit formed on an insulating layer and having a region corresponding to the connector portion peeled off, an inner layer circuit side of the inner layer substrate and an insulating layer side of the outer layer substrate being adhered to one another via an adhesive layer so as to face one another, and a conductor layer other than the connector portion of the inner layer circuit being adhered to the outer layer substrate directly by the adhesive layer.