Electronic Component Integration into Printed Circuit Board

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Solution Overview

Problem

The integration of electronic components into printed circuit boards faces challenges such as mechanical and thermal stresses due to material differences, complex alignment requirements, and increased production effort and rejects, especially with miniaturization and high-density components, where pre-drilled holes lead to inaccuracies and gas inclusion issues.

Innovation Solution

The method involves fixing the electronic component on the insulating layer first, then forming holes or openings in both the conductive and insulating layers separately, using markings for alignment, and forming additional perforations outside the component area to simplify the positioning and reduce the number of process steps, allowing for precise and reliable contact formation without pre-drilled holes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If holes or openings are formed in the conductive layer and insulating layer before component placement, then contact points are prepared in advance, but manufacturing precision deteriorates due to alignment difficulties and tolerance requirements

Engineering Contradiction:

Improveproduction timeVSAvoidalignment precision

Core Design Contradiction:

Loss of timeVSManufacturing precision

Solution Approach 1:

The patent inverts the conventional sequence by placing the electronic component on the insulating layer first, then forming holes or openings in the conductive and insulating layers subsequently. This reversal eliminates the need for pre-alignment of holes with component contacts, as the holes are formed after the component is already positioned, thereby resolving the alignment precision issue while maintaining production efficiency

Inventive Principle:

Principle #13The other way round (Inversion)

2Adaptability or versatility

If recesses or holes are provided in the printed circuit board for component integration, then components can be embedded, but device complexity increases due to additional drilling and conductor track formation steps

Engineering Contradiction:

Improvecomponent integration capabilityVSAvoidprocess complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by forming the holes or openings in the conductive and insulating layers after component placement but before final encapsulation. This timing allows the component to serve as a reference for hole positioning, simplifying the overall process by eliminating the need for separate alignment and positioning steps that would otherwise be required

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent merges the hole formation process with the component integration process by forming the holes in both the conductive and insulating layers as part of the same sequence operation after component placement. This combining of operations reduces the total number of separate process steps and simplifies the overall manufacturing流程

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If soldering processes and bonding techniques are used for contacting components, then reliable electrical contact is achieved, but reliability deteriorates due to thermal expansion differences causing cracks

Engineering Contradiction:

Improvecontact reliabilityVSAvoidcontact point strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent changes the process parameters by forming holes or openings after component placement rather than before, which eliminates the need for high-temperature soldering processes. The contacts are established through the formed holes without subjecting the component contacts to extreme thermal conditions, thereby preventing thermal expansion-induced cracking while maintaining contact reliability

Inventive Principle:

Principle #35Parameter changes

4Ease of manufacture

If pre-drilled holes are used for component contacts, then contact points are defined early, but manufacturing precision deteriorates due to laser drilling stress and positioning errors

Engineering Contradiction:

Improvecontact point formationVSAvoidcontact point positioning

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent inverts the conventional approach by forming the holes or openings in the conductive and insulating layers after the component is already placed on the insulating layer. This eliminates the need for precise pre-positioning of holes relative to component contacts, as the component itself serves as the reference for subsequent hole formation, thereby improving manufacturing precision while maintaining ease of manufacture

Inventive Principle:

Principle #13The other way round (Inversion)

Data Source

PatentEP2342958B1Method for integrating an electronic component into a printed circuit board

Publication Date: 2020.06.17 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

Figure 1a~1e
Figure 1f~1j
Figure 2a~2f

AI summary

The invention relates to a method for integrating an electronic component into a printed circuit board, whereby the electronic component (4) comprising contacts (6) oriented towards the insulating layer (1) is fixed to a laminate at least consisting of a conducting or conductive layer (2) and a non-conducting or insulating layer (1). According to the invention, once the component (4) has been fixed to the insulating layer (1), holes or perforations (8, 11) corresponding to the contacts (6) of the component (4) are formed in the conducting layer (2) and in the insulating layer (1), the contacts (6) coming into contact with the conducting layer (2), enabling a reliable integration or embedding of an electronic component (4) into a printed circuit board.