Circuit Assembly Relay Member Level Difference Reduction
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Solution Overview
Problem
Existing circuit assemblies face challenges in forming protruding portions for multiple terminals at close positions, leading to difficulties in manufacturing and increased level differences between terminal connections and the substrate mounting surface, which can cause stress on electronic components due to temperature changes.
Innovation Solution
A circuit assembly design featuring a plate-shaped conductive member and relay members made of conductive material, where the relay members are fixed to the conductive member using a pressure applying means, ensuring a flat surface connection and minimizing linear expansion coefficient differences to reduce thermal stress, allowing for easy manufacturing and reduced burden on electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple protruding portions are formed by bending a conductive member at close positions, then the conductive member can connect multiple terminals, but it becomes difficult to form the protruding portions and manufacturing complexity increases
Solution Approach 1:
The patent divides the connection function into separate components: the conductive member remains a simple plate structure, while individual relay members are formed separately to connect to terminals. This segmentation allows multiple connections without complex forming operations on the conductive member itself.
Solution Approach 2:
The relay member is extracted as a separate component from the conductive member. Instead of forming all connection features directly on the conductive member, the relay member is manufactured independently and then attached, simplifying the manufacturing of the conductive member while achieving multiple terminal connections.
2Ease of operation
If protruding portions are formed to eliminate level difference for easy component mounting, then electronic components can be mounted easily, but manufacturing difficulty increases when multiple protruding portions are needed at close positions
Solution Approach 1:
The level-equalizing function is segmented and assigned to individual relay members rather than being formed as protruding portions on the conductive member. Each relay member provides the necessary height adjustment independently, allowing multiple connections at close positions without manufacturing complexity.
Solution Approach 2:
The relay member acts as an intermediary between the conductive member and the electronic component terminal. It provides the necessary height difference elimination and electrical connection in a separate, manufacturable component rather than requiring complex forming of the conductive member.
3Device complexity
If relay members are fixed to the conductive member without pressure applying means, then the structure is simpler, but the level difference between terminal connections and substrate mounting surface increases causing thermal stress
Solution Approach 1:
The pressure applying means is designed to automatically apply uniform pressure to multiple relay members during the fixing process. The tapered surfaces of the pressing members self-align and distribute force evenly, eliminating the need for complex external pressure application devices while ensuring proper level alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables easy production of circuit assemblies with reduced level differences between terminal connections and the substrate, enhancing the durability and ease of mounting electronic components by minimizing thermal expansion-related stress and manufacturing complexities.
Implementation Method 1
a pressure applying means for pressing the plurality of relay members against the conductive member is used in the relay member fixing step
Implementation Method 2
a difference between linear expansion coefficients of a material constituting the substrate and a material constituting the relay member may be smaller than 10 ppm/° C.
Data Source
AI summary
Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically connected to a conductive member are connected, and that can be easily produced, and a method for manufacturing the same. A circuit assembly includes a substrate provided with openings and an electronic component mounted on one side of the substrate, a conductive member that is a plate-shaped member fixed to another side of the substrate, the conductive member constituting a conductive path, and a relay member that is fixed to a surface on the substrate side of the conductive member and made of an electrically conductive material, the relay member being accommodated in the openings formed in the substrate, at least one terminal of the electronic component being connected to the relay member.