Reusable Hot Pressing Stage With Detachable PCB Supports
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Solution Overview
Problem
The existing object stages for hot pressing PCBs are not reusable, leading to increased manufacturing costs and reduced production efficiency due to the need for a new stage for each type of PCB, resulting in waste and prolonged production time.
Innovation Solution
An object stage with detachable support sub-devices that can be rearranged to accommodate different types of PCBs, using a base with location structures and vacuum holes to securely hold the PCB, and optionally incorporating an electromagnetic coil for easy attachment and detachment of support sub-devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dedicated object stage is designed and manufactured for each PCB type, then the PCB can be steadily placed during hot pressing, but the manufacturing cost increases and production efficiency decreases due to the need to replace object stages for different PCB types
Solution Approach 1:
The object stage is divided into a base and multiple detachable support sub-devices. The support sub-devices can be independently attached or detached from the base according to different PCB types, allowing the base to be reused while only changing the necessary support components. This segmentation enables steady placement for different PCB types without replacing the entire object stage.
Solution Approach 2:
The base is designed as a universal platform that can accommodate different types of PCBs through the attachment of various support sub-devices. The location structures on the base allow different configurations of support sub-devices to be mounted, making a single base serve multiple functions for different PCB types, thereby improving production efficiency.
2Reliability
If a dedicated object stage is designed and manufactured for each PCB type, then the PCB can be steadily placed during hot pressing, but the manufacturing cost increases due to the need to produce multiple object stages
Solution Approach 1:
The object stage is divided into a base and multiple detachable support sub-devices. The support sub-devices can be independently attached or detached from the base according to different PCB types, allowing the base to be reused while only changing the necessary support components. This segmentation enables steady placement for different PCB types without replacing the entire object stage.
Solution Approach 2:
Instead of discarding or replacing the entire object stage for different PCB types, the invention allows recovery and reuse of the base. Only the support sub-devices need to be changed or repositioned, significantly reducing manufacturing costs by recovering the main structural component for repeated use.
3Adaptability or versatility
If the object stage is replaced for each different PCB type, then the correct matching is ensured, but the production time increases due to the replacement process
Solution Approach 1:
The object stage is divided into a base and multiple detachable support sub-devices. The support sub-devices can be independently attached or detached from the base according to different PCB types, allowing the base to be reused while only changing the necessary support components. This segmentation enables steady placement for different PCB types without replacing the entire object stage.
Solution Approach 2:
The object stage configuration is made dynamic through the ability to quickly attach and detach support sub-devices on the base. This dynamic reconfiguration allows rapid adaptation to different PCB types without the time-consuming process of replacing entire object stages, improving production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the reuse of the object stage for different PCB types, reducing manufacturing costs and production time while improving efficiency by allowing for quick adaptation without replacing the stage.
Implementation Method 1
the electromagnetic coil is configured to provide the base and the support sub-device with opposite magnetic properties when powered on, so that the base and the support sub-devices are attracted with each other
Implementation Method 2
the electromagnetic coil is further configured to demagnetize both of the base and the support sub-devices when powered off, so that the base and the support sub-devices are no longer attracted with each other
Implementation Method 3
the first vacuum holes and the second vacuum holes form vacuum air paths which are configured to hold the PCB under a vacuum state
Data Source
AI summary
An object stage and a hot pressing apparatus are disclosed. The object stage includes a base (1) and a support device (2) fixed on the base (1), wherein the support device (2) includes a plurality of detachable support sub-devices (21); the support device is configured to allow a printed circuit board (3) with at least one protruding structure (4) to be placed thereon, and no support sub-device (21) is disposed at a position on the support device (2) corresponding to the protruding structure (1). The object stage reduces manufacture cost, saves production time and improves production efficiency.