Display Device Circuit Board Bending and Adhesive Bonding
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Solution Overview
Problem
Conventional display devices have a large frame size due to a significant distance between the circuit board and the backlight module when the circuit board is bent, resulting in a relatively small screen-to-body ratio.
Innovation Solution
A display device design that includes a display panel, a backlight module, and a circuit board with an adhesive layer, where the circuit board is bent to attach to the backlight module using an adhesive layer, and through holes are incorporated in the bending part to relieve stress, reducing the frame size and improving circuit board durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the circuit board is bent from the display panel surface to the backlight module surface, then the frame ratio is reduced, but the bending radius is large causing excessive distance between circuit board and backlight module
Solution Approach 1:
An adhesive layer is introduced as an intermediary component between the circuit board and the backlight module. This adhesive layer enables the circuit board to be positioned close to the backlight module while maintaining structural integrity, thus reducing the distance between them without requiring a large bending radius.
Solution Approach 2:
The invention changes the bending radius parameter of the circuit board to a smaller value, allowing the circuit board to bend more sharply and attach closer to the backlight module surface, thereby reducing the distance while maintaining the reduced frame ratio.
2Area of stationary object
If the circuit board is bent with a large bending radius, then the frame size increases, but the screen-to-body ratio decreases
Solution Approach 1:
The invention changes the bending radius parameter to a smaller value, which directly reduces the frame size and increases the screen-to-body ratio by allowing the circuit board to attach closer to the backlight module surface.
3Area of stationary object
If the circuit board is bent to attach to the backlight module, then the frame size is reduced, but stress concentration occurs at the bending part corners
Solution Approach 1:
Through holes are extracted or removed from the bending part of the circuit board, specifically at the corners where stress concentration occurs. This removal of material relieves the concentrated stress and prevents cracking, thereby improving the reliability and service life of the circuit board.
4Length of stationary object
If adhesive layer is used to bond circuit board to backlight module, then the distance is reduced, but manufacturing complexity increases
Solution Approach 1:
The adhesive layer is applied uniformly across the bonding surface, creating a homogeneous bonding structure that simplifies the manufacturing process. The uniform application and consistent thickness make the assembly process more controllable and easier to manufacture at scale.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces the distance between the circuit board and the backlight module, minimizing the frame size and enhancing the circuit board's service life by distributing stress evenly.
Implementation Method 1
an adhesive layer including a first surface and a second surface disposed opposite to each other, wherein the first surface of the adhesive layer is bonded to a side of the backlight module close to the circuit board, and the second surface of the adhesive layer is bonded to the circuit board
Data Source
AI summary
A display device is provided, which includes a display panel including a first surface and a second surface of the display panel disposed opposite to each other; a backlight module including a first surface and a second surface of the backlight module disposed opposite to each other, wherein the first surface of the backlight module is attached to the second surface of the display panel; a circuit board including an end attached to the first surface of the display panel and another end bent to the second surface of the backlight module; and an adhesive layer including a first surface and a second surface disposed opposite to each other, wherein the first surface of the adhesive layer is bonded to a side of the backlight module close to the circuit board, and the second surface of the adhesive layer is bonded to the circuit board.