Standoff Interposer for PCB Z-Height Spacing and Electrical Connection
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Solution Overview
Problem
Current electrical interconnect solutions between circuit boards consume significant space and increase costs, particularly when height differences require complex or expensive connector solutions, making assembly and maintenance challenging.
Innovation Solution
The use of a standoff interposer with conductive pathways and a central passage that allows for electrical connections between circuit boards, providing Z-height spacing and securing the boards while reducing the need for separate connectors, utilizing a fastener to compress conductive pathways for enhanced contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connectors are used for board-to-board connections, then electrical connections between circuit boards are established, but PCB area is consumed and system board dimensions must be enlarged
Solution Approach 1:
The patent combines the electrical connection function and the Z-height spacing function into a single integrated interposer structure. The interposer merges multiple functions (electrical interconnection, height adjustment, mechanical support) that were previously performed by separate components, thereby eliminating the need for additional connectors and reducing PCB area consumption.
Solution Approach 2:
The interposer serves multiple functions simultaneously: it provides electrical pathways for signal transmission, creates Z-height spacing between boards with different component heights, and offers mechanical support for mounting. This multi-functionality replaces what would traditionally require multiple separate components, reducing overall space requirements.
2Adaptability or versatility
If height difference between components is accommodated using existing connector solutions, then boards can be connected at different Z-axis levels, but assembly difficulty increases and costs increase
Solution Approach 1:
The interposer is designed with adjustable height parameters to accommodate different Z-axis level requirements. By varying the interposer height, the system can adapt to different component height differences without requiring different connector types or complex assembly procedures, thereby maintaining simplicity while providing versatility.
3Reliability
If traditional connector solutions are used for board connections, then electrical connections are established, but costs increase due to additional connectors
Solution Approach 1:
The interposer combines the electrical connection function and the Z-height spacing function into a single integrated structure. The interposer merges multiple functions (electrical interconnection, height adjustment, mechanical support) that were previously performed by separate components, thereby eliminating the need for additional connectors and reducing component count.
Data Source
AI summary
An electronic device and associated methods are disclosed. In one example, the electronic device includes a standoff interposer between an overlapping portion of a first circuit board and a second circuit board. In selected examples, electronic devices and methods described show one or more conductive pathways within a standoff interposer that provide electrical communication between circuit boards, such as data signals, power delivery, etc.