Semiconductor Contact Component with Concave Flange for Solder Control
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Solution Overview
Problem
Conventional contact components in semiconductor modules face challenges in maintaining long-term solder junction strength while preventing solder climb-up, as reducing solder amount to prevent defects leads to unreliable connections due to insufficient junction strength.
Innovation Solution
The contact component design includes a cylindrical portion with a flange having a flat bottom surface and a concave portion extending from the inner to the outer circumference edge, along with a cut-out, chamfered, or recessed surface at the lower end, which increases the solder volume in the concave portion and reduces the amount entering the cylinder, enhancing junction strength and preventing solder climb-up.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the amount of solder is reduced to prevent solder climb-up defects, then the occurrence of defects is reduced, but the junction strength becomes insufficient and reliability deteriorates
Solution Approach 1:
The flange end face is designed with a concave portion that concentrates solder in a specific local area, creating different solder distribution zones: the concave portion holds sufficient solder for strong junction, while the cylindrical hole receives minimal solder to prevent climb-up defects. This local differentiation resolves the contradiction between preventing defects and ensuring strength.
Solution Approach 2:
The flange end face is segmented into distinct functional zones: a concave portion for solder accumulation and junction strength, and a cylindrical hole for terminal insertion with minimal solder. This segmentation allows independent optimization of each zone - the concave portion ensures strong bonding while the hole minimizes solder climb-up, resolving the overall contradiction.
2Strength
If a flange with large diameter is used to increase solder surface area and ensure junction strength, then the solder junction strength is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
Instead of uniformly increasing the entire flange diameter to enhance junction strength, the invention creates a localized concave portion on the flange end face. This concentrates the solder surface area enhancement in a specific location, providing strong junction strength only where needed at the solder interface, while keeping the rest of the flange structure simple and easy to manufacture.
Solution Approach 2:
The invention adds vertical depth to the flange end face by creating a concave portion, transforming a two-dimensional flat surface into a three-dimensional structured surface. This dimensional change increases the effective solder surface area and volume within the same flange footprint, enhancing junction strength without increasing flange diameter or overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves solder junction strength comparable to or exceeding conventional methods while minimizing solder inside the cylinder, effectively preventing defects and maintaining reliability by optimizing solder distribution and surface area contact.
Implementation Method 1
When soldering the end faces of the flanges 106 of the contact components 103 to the insulating substrate 102, the solder 111 pressed against the inner diameter side of each flange 106, of the solder 111 on the lower side of the flange 106, enters into the concave portion 107 inside the flange 106
Implementation Method 2
the solder 111 which has been filled inside the contact component 103 climbs up the inner walls of the cylinder due to a capillary action
Data Source
AI summary
A contact component adapted to be soldered onto a metal region provided on an insulating substrate of a semiconductor module includes a cylindrical portion; a hollow hole for fitting an external terminal; and a flange formed at a lower end portion of the cylindrical portion and having a diameter larger than an external diameter of the cylindrical portion. An end face of the flange adapted to be soldered includes a flat bottom surface and a concave portion extending from an inner circumference edge of the cylindrical portion in the flat bottom surface to an outer circumference edge of the flange. The cylindrical portion includes a cut-out portion at an inner side of a lower end thereof.