Substrate-Type Terminal Groove Formation for Burr-Free Cutting
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Solution Overview
Problem
Existing methods for producing substrate-type terminals often result in burrs during cutting, which can displace multilayer ceramic capacitors and require the use of green resist to prevent burr formation, leading to inaccurate placement and potential detachment of devices under external impact.
Innovation Solution
A method involving groove formation and cutting of substrates to create substrate-type terminals where grooves are formed without extending through the substrate, preventing burrs from protruding and eliminating the need for green resist, while using a support member to prevent splintering and ensure accurate placement of devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If green resist is applied on the conductive pattern before cutting the insulating substrate to prevent burrs, then burr formation is prevented, but the multilayer ceramic capacitor may be displaced from its intended location
Solution Approach 1:
The groove is formed in advance on the insulating substrate before the device mounting step. This preliminary groove structure prevents burr formation during subsequent cutting operations without requiring green resist application, thereby maintaining device placement accuracy while eliminating the harmful burr formation
Solution Approach 2:
The harmful green resist material is completely removed from the process. Instead of applying green resist to prevent burrs, the invention extracts this problematic intermediate material and replaces it with a groove structure that achieves burr prevention through mechanical means alone, eliminating the source of device displacement
2Productivity
If the insulating substrate is cut without grooves to improve productivity, then cutting speed increases, but burrs occur and require green resist application
Solution Approach 1:
The groove is formed as a preliminary structure before the final cutting operation. This pre-formed groove guides the cutting blade and prevents burr formation during high-speed cutting, enabling both high productivity and burr-free edges without requiring additional green resist processing steps
3Object-generated harmful factors
If green resist is applied to prevent burrs, then burr formation is controlled, but device displacement occurs and additional process steps are required
Solution Approach 1:
The green resist application process is completely extracted and removed from the manufacturing flow. The invention replaces this chemical-based burr prevention method with a mechanical groove structure, simplifying the overall process by eliminating resist application, drying, and removal steps
Solution Approach 2:
The groove acts as an intermediary structure between the cutting blade and the insulating substrate. This groove features guide the cutting process and prevent burr formation through its geometric design, serving as a passive mechanical mediator that eliminates the need for active green resist intervention
Data Source
AI summary
A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.