Composite Circuit Board with Thermal Interface for LED Heat Dissipation
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Solution Overview
Problem
Metal substrates used in LED assemblies provide good heat dissipation but are limited by having only one circuit layer, which restricts their functional applications beyond heat management.
Innovation Solution
A circuit board with a composite structure layer comprising at least two conductive members and a thermally conductive substrate connected via a thermal interface material, allowing for effective heat dissipation and multi-layer circuit functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal substrate is used, then heat dissipation performance is improved, but the number of circuit layers is limited to one
Solution Approach 1:
The patent uses a composite structure combining metal substrate with organic circuit layers. The metal substrate provides thermal conduction, while organic insulating layers with conductive patterns provide circuit functionality. This composite approach allows multiple circuit layers to be stacked on the metal substrate, resolving the contradiction between heat dissipation and circuit layer capacity.
Solution Approach 2:
The patent divides the circuit board into distinct functional layers: a metal substrate layer for heat dissipation, organic insulating layers for electrical isolation, and conductive patterns for circuit traces. This segmentation allows each layer to optimize its specific function while working together, enabling multiple circuit layers without compromising heat dissipation performance.
2Temperature
If a metal substrate with one circuit layer is used, then heat dissipation is effective, but functional applications are limited
Solution Approach 1:
The patent creates a multi-functional circuit board where the metal substrate serves both as a structural base and a heat dissipation platform, while stacked organic layers provide multiple circuit layers for various electronic functions. This universal design enables the same structure to support both thermal management and diverse electronic applications simultaneously.
Solution Approach 2:
The patent transitions from a single-layer circuit design to a multi-layer stacked architecture, adding the dimension of vertical layer stacking. This dimensional change allows multiple circuit layers to be integrated above the metal substrate, significantly increasing functional versatility while preserving the heat dissipation capability of the base metal layer.
3Adaptability or versatility
If multiple circuit layers are added, then functional capabilities are improved, but heat dissipation performance may deteriorate
Solution Approach 1:
The patent introduces organic insulating layers as intermediaries between the metal substrate and the conductive circuit layers. These intermediary layers provide electrical isolation while allowing thermal energy to pass through to the metal substrate, thus enabling multiple circuit layers without blocking heat dissipation pathways.
Solution Approach 2:
The patent applies different material properties to different regions: the metal substrate provides high thermal conductivity for heat dissipation, while the organic insulating layers provide electrical isolation for circuit functionality. This local differentiation of material qualities allows simultaneous optimization of both heat dissipation and circuit capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables both efficient heat dissipation and enhanced circuit functionality, enabling the circuit board to support multiple circuit layers and improve its application scope beyond just heat management.
Implementation Method 1
The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate
Data Source
AI summary
A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.