Printhead Die Embedding in PCB Molding for Fluid Delivery
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Solution Overview
Problem
Conventional inkjet printer print bars face challenges in reducing the size and spacing of printhead dies while maintaining efficient fluid delivery, leading to increased costs due to complex flow structures and fabrication processes.
Innovation Solution
A new fabrication process where printhead die slivers are embedded in a molding on a printed circuit board with exposed nozzles and channels cut through the PCB to supply fluid directly to the die slivers, allowing for smaller die sizes and simplified assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If printhead die size is reduced to lower cost, then manufacturing cost decreases, but fluid delivery complexity increases
Solution Approach 1:
The patent transitions from planar fluid delivery to three-dimensional fluid pathways by routing channels through the thickness of the substrate. This allows fluid to be delivered to reduced-size printhead dies without requiring complex lateral flow structures, thus reducing die size while maintaining simple fluid delivery paths.
Solution Approach 2:
The patent embeds multiple fluid channels within the substrate thickness, nesting them in the vertical dimension. This allows multiple fluid delivery paths to coexist without increasing lateral complexity, enabling smaller printhead dies to be served by simplified channel structures.
2Productivity
If printhead die spacing is reduced to increase density, then printing speed increases, but fluid channel complexity increases
Solution Approach 1:
By utilizing the vertical dimension for fluid channel routing through the substrate, the patent allows tighter lateral spacing of printhead dies without increasing channel complexity. The three-dimensional pathways efficiently serve closely-spaced dies that would require complex lateral routing in conventional planar designs.
3Reliability
If conventional multi-part fluid delivery structures are used, then fluid delivery is reliable, but manufacturing cost increases
Solution Approach 1:
The patent integrates fluid delivery channels directly into the substrate structure, merging the substrate and fluid delivery system into a single component. This eliminates the need for separate fluid delivery parts while maintaining reliable fluid transport, thereby reducing manufacturing cost through part consolidation.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for the printhead dies, electrical insulation, and integrated fluid delivery pathways. This multi-functionality reduces the need for separate components, lowering manufacturing cost while maintaining reliable fluid delivery.
Data Source
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AI summary
In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.